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Ilderem, Vida
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1

Innovations for Intelligent Edge:

, In: ESSCIRC 2022- IEEE 48th European Solid State Circuits Conference (ESSCIRC),
Ilderem, Vida ; Pellerano, Stefano ; Tschanz, Jim.. - p. 41-44 , 2022
Link: https://doi.org/10.1109/..
 
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2

6G: Connectivity in the Era of Distributed Intelligence:

Talwar, Shilpa ; Himayat, Nageen ; Nikopour, Hosein...
IEEE Communications Magazine.  59 (2021)  11 - p. 45-50 , 2021
Link: https://doi.org/10.1109/..
 
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3

Innovation for Future Connected Compute:

, In: Proceedings of the 2016 International Symposium on Low Power Electronics and Design,
Ilderem, Vida - p. 1 ff. , 2016
Link: https://dl.acm.org/doi/1..
 
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4

Embedded market : challenges and opportunities:

, In: Proceedings of the eighth IEEE/ACM/IFIP international conference on Hardware/software codesign and system synthesis,
Ilderem, Vida - p. 1-2 , 2010
Link: https://dl.acm.org/doi/1..
 
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5

Research and development for seamless mobility:

, In: Proceedings of the 15th ACM Great Lakes symposium on VLSI,
Ilderem, Vida - p. 225 ff. , 2005
Link: https://dl.acm.org/doi/1..
 
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6

Effect of boron on gate oxide degradation and reliability i..:

Brozek, Tomasz ; Kyono, Carl ; Ilderem, Vida
Solid-State Electronics.  45 (2001)  8 - p. 1293-1297 , 2001
Link: https://doi.org/10.1016/..
 
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7

Boron penetration effect on gate oxide reliability of 50 Å ..:

Kyono, Carl ; Brożek, Tomasz ; Ilderem, Vida
Microelectronics Reliability.  40 (2000)  4-5 - p. 637-640 , 2000
Link: https://doi.org/10.1016/..
 
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8

6G: Connectivity in the Era of Distributed Intelligence:

Talwar, Shilpa ; Himayat, Nageen ; Nikopour, Hosein...
http://arxiv.org/abs/2110.07052.  , 2021
Link: http://arxiv.org/abs/211..
 
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9

Method and Apparatus for Enabling Digital Rights Management..:

Olson, William L ; Ilderem, Vida ; Kitson, Frederick L...
https://ecommons.luc.edu/cs_facpubs/80.  , 2012
Link: https://ecommons.luc.edu..
 
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