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2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ,
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Thermal Modeling and Optimization of Mobile Device using mo..:
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2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ,
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Thermal Aware Floorplan Optimization of SoC in Mobile Phone:
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2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) ,
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Equivalent thermal conductivity of a composite structure co..:
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2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) ,
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Thermal Model Simplification of Mobile Device with Adaptive..:
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Proceedings of the ACM/IEEE International Symposium on Low Power Electronics and Design ,
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3D IC Tier Partitioning of Memory Macros: PPA vs. Thermal T..:
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2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) ,
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Thermal perspective design Analysis of 3D stacked chip inte..:
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2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) ,
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Thermal-Aware Optimization of SoC Floorplan with Heterogeno..:
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2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) ,
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Optimization of hotspot location on multi stacked board of ..:
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2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) ,
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Methodology for Accurate Hotspot Prediction by Upscale Spat..:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
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Thermal and Power Delivery Aware Floorplanning for Heteroge..:
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2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ,
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Pattern Continuity Check Approach to Model Effective Therma..:
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2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ,
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Impact of Chip, Package, and Set Design on Transient Temper..:
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2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ,
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Thermal Sensor Placement based on Meta-Model Enhancing Obse..:
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2019 International Wafer Level Packaging Conference (IWLPC) ,
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