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Im, Yunhyeok
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1

Fast and Real-Time Thermal-Aware Floorplan Methodology for ..:

Cho, Youngsang ; Kim, Heonwoo ; Lee, Kyoungmin...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  , 2024
Link: https://doi.org/10.1109/..
 
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2

Thermal Modeling and Optimization of Mobile Device using mo..:

, In: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm),
Im, Yunhyeok ; Jung, Gyuick ; Lee, Myunghoon.. - p. 1-8 , 2023
Link: https://doi.org/10.1109/..
 
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3

Thermal Aware Floorplan Optimization of SoC in Mobile Phone:

, In: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm),
Cho, Youngsang ; Kim, Heonwoo. ; Lee, Kyoungmin... - p. 1-7 , 2023
Link: https://doi.org/10.1109/..
 
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4

Equivalent thermal conductivity of a composite structure co..:

, In: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm),
Hyun, Younghoon ; Lee, Bruce Weon ; Wook Jung, Ki... - p. 1-8 , 2022
Link: https://doi.org/10.1109/..
 
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5

Thermal Model Simplification of Mobile Device with Adaptive..:

, In: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm),
Im, Yunhyeok ; Jo, Hyungyung ; Oh, Chigwan... - p. 1-6 , 2022
Link: https://doi.org/10.1109/..
 
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6

3D IC Tier Partitioning of Memory Macros: PPA vs. Thermal T..:

, In: Proceedings of the ACM/IEEE International Symposium on Low Power Electronics and Design,
Zhu, Lingjun ; Bethur, Nesara Eranna ; Lu, Yi-Chen... - p. 1-6 , 2022
Link: https://dl.acm.org/doi/1..
 
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7

Thermal perspective design Analysis of 3D stacked chip inte..:

, In: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm),
Cho, Youngsang ; Lee, Kyoungmin ; Hwang, Kyojin... - p. 1-6 , 2022
Link: https://doi.org/10.1109/..
 
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8

Thermal-Aware Optimization of SoC Floorplan with Heterogeno..:

, In: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm),
Yoo, Jongkyu ; An, Taekeun ; Oh, Chigwan... - p. 1-6 , 2022
Link: https://doi.org/10.1109/..
 
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9

Optimization of hotspot location on multi stacked board of ..:

, In: 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm),
Cho, Youngsang ; Yoo, Jongkyu ; Im, Yunhyeok... - p. 484-490 , 2021
Link: https://doi.org/10.1109/..
 
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10

Methodology for Accurate Hotspot Prediction by Upscale Spat..:

, In: 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm),
An, Taekeun ; Im, Yunhyeok ; Yoo, Jongkyu... - p. 130-138 , 2021
Link: https://doi.org/10.1109/..
 
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11

Thermal and Power Delivery Aware Floorplanning for Heteroge..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Im, Yunhyeok ; Cho, Young-Sang ; Hwang, Jisoo... - p. 2072-2077 , 2020
Link: https://doi.org/10.1109/..
 
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12

Pattern Continuity Check Approach to Model Effective Therma..:

, In: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm),
Cho, Youngsang ; Hyun, Younghoon ; Im, Yunhyeok. - p. 909-917 , 2020
Link: https://doi.org/10.1109/..
 
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13

Impact of Chip, Package, and Set Design on Transient Temper..:

, In: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm),
Yoo, Jongkyu ; Im, Yunhyeok ; Lee, Heeseok... - p. 229-235 , 2020
Link: https://doi.org/10.1109/..
 
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14

Thermal Sensor Placement based on Meta-Model Enhancing Obse..:

, In: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm),
Im, Yunhyeok ; Kim, Wook ; An, Taekeun... - p. 776-782 , 2020
Link: https://doi.org/10.1109/..
 
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15

Highly Integrated SIP for Mobile Device:

, In: 2019 International Wafer Level Packaging Conference (IWLPC),
Kim, JungHwa ; Lee, Heeseok ; Choi, HeeJung.. - p. 1-6 , 2019
Link: https://doi.org/10.23919..
 
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