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Imbert, Bruno
269
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Online (269)
Mediatypes
Articles (Online) (59)
Bookchapter (Online) (3)
OpenAccess-fulltext (207)
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english (232)
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1
Aluminum-Germanium Eutectic Bonding for MEMS: Behaviour and..:
Lumineau, Victor
;
Fournel, Frank
;
Imbert, Bruno
.
ECS Transactions. 75 (2016) 9 - p. 273-281 , 2016
Link:
https://doi.org/10.1149/..
?
2
Voiding Phenomena in Copper-Copper Bonded Structures: Role ..:
Gondcharton, Paul
;
Imbert, Bruno
;
Benaissa, Lamine
.
ECS Transactions. 64 (2014) 5 - p. 357-367 , 2014
Link:
https://doi.org/10.1149/..
?
3
Evaluation of Titanium Direct Bonding Mechanism:
Baudin, Floriane
;
Delaye, Vincent
;
Guedj, Cyril
...
ECS Transactions. 50 (2013) 7 - p. 125-132 , 2013
Link:
https://doi.org/10.1149/..
?
4
Wafer Level 3D Stacking Using Smart Cut and Metal-Metal Dir..:
Di Cioccio, Lea
;
Radu, Ionut
;
Baudin, Floriane
...
ECS Transactions. 50 (2013) 7 - p. 169-175 , 2013
Link:
https://doi.org/10.1149/..
?
5
LiNbO3 Single Crystal Layer Transfer Techniques for High Pe..:
Deguet, Chrystel
;
Pijolat, Mathieu
;
Blanc, Nicolas
...
ECS Transactions. 33 (2010) 4 - p. 225-232 , 2010
Link:
https://doi.org/10.1149/..
?
6
Formulation reproducing the ignition delays simulated by a ..:
Imbert, Bruno
;
Lafosse, Fabien
;
Catoire, Laurent
..
Combustion and Flame. 155 (2008) 3 - p. 380-408 , 2008
Link:
https://doi.org/10.1016/..
?
7
Silicide pre-clean effects on NiPtSi thermal stability for ..:
Bonnetier, Susana
;
Imbert, Bruno
;
Hopstaken, Marco
...
Microelectronic Engineering. 84 (2007) 11 - p. 2528-2532 , 2007
Link:
https://doi.org/10.1016/..
?
8
Ignition Delays of Heptane/O2/Ar Mixtures in the 1300-1600 ..:
Imbert, Bruno
;
Catoire, Laurent
;
Chaumeix, Nabiha
.
Journal of Propulsion and Power. 20 (2004) 3 - p. 415-426 , 2004
Link:
https://doi.org/10.2514/..
?
9
Mesure par thermographie infra-rouge du taux de restitution..:
Bouvet, Christophe
;
Prévautel, Kathy
;
Mathieu, Julien
..
hal-01623245. , 2017
Link:
https://hal.science/hal-..
?
10
Mesure par thermographie infra-rouge du taux de restitution..:
Bouvet, Christophe
;
Prévautel, Kathy
;
Mathieu, Julien
..
hal-01623245. , 2017
Link:
https://hal.archives-ouv..
?
11
Mise en place d'un packaging 3D collectif de composants de ..:
Letowski, Bastien
;
Widiez, Julie
;
Rouger, Nicolas
...
hal-01361603. , 2016
Link:
https://hal.science/hal-..
?
12
Mise en place d'un packaging 3D collectif de composants de ..:
Letowski, Bastien
;
Widiez, Julie
;
Rouger, Nicolas
...
hal-01361603. , 2016
Link:
https://hal.archives-ouv..
?
13
Mise en place d'un packaging 3D collectif de composants de ..:
Letowski, Bastien
;
Widiez, Julie
;
Rouger, Nicolas
...
hal-01361603. , 2016
Link:
https://hal.science/hal-..
?
14
CMOS transistors process integration effects on Nickel-Plat..:
Imbert, Bruno
tel-00421859. , 2009
Link:
https://theses.hal.scien..
?
15
CMOS transistors process integration effects on Nickel-Plat..:
Imbert, Bruno
tel-00421859. , 2009
Link:
https://tel.archives-ouv..
1-15