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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
1
Quantifying the Electrical Impact of Bonding Misalignment f..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
2
0.5 μm Pitch Next Generation Hybrid Bonding with High Align..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
3
Multi-Physics Simulation of Wafer-to-Wafer Bonding Dynamics:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
5