Search for persons
X
?
2021 33rd International Symposium on Power Semiconductor Devices and ICs (ISPSD) ,
5
Low temperature Cu sinter joining on different metallizatio..:
, In:
?
The Minerals, Metals & Materials Series; TMS 2021 150th Annual Meeting & Exhibition Supplemental Proceedings ,
6
Reliability Evaluation of Ag Sinter-Joining Die Attach Unde..:
, In:
?
2021 International Conference on Electronics Packaging (ICEP) ,
7