Iyengar, Madhusudan
14  results:
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1

Moving Towards Microchannel-based Chip Cooling:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Semenza, Paul ; Thomas, Dave ; Oakes, Garrett... - p. 408-414 , 2024
 
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4

Thermal design and management of micro-pin fin heat sinks f..:

Jung, Daewoong ; Lee, Haeun ; Kong, Daeyoung...
International Journal of Heat and Mass Transfer.  175 (2021)  - p. 121192 , 2021
 
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5

Mechanical Design and Reliability of Gold-Tin Eutectic Bond..:

, In: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm),
Soroush, Farid ; Jung, Ki Wook ; Iyengar, Madhusudan... - p. 957-962 , 2020
 
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6

Single-phase thermal and hydraulic performance of embedded ..:

Kong, Daeyoung ; Jung, Ki Wook ; Jung, Sangwoo...
International Journal of Heat and Mass Transfer.  141 (2019)  - p. 145-155 , 2019
 
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7

Investigation of the confinement effect on the evaporation ..:

Li, Junhui ; Shan, Li ; Ma, Binjian...
Journal of Colloid and Interface Science.  555 (2019)  - p. 583-594 , 2019
 
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8

Cooling of microelectronic and nanoelectronic equipment 

Thermal packaging toolsVol. 1:

, In: , In: Encyclopedia of thermal packaging : a guide to cooling of electronic equipment; [Set 2:] / editor-in-chief: Avram Bar-Cohen,
advances and emerging research 
Copies:  Zentrale:E02 h elt 688 m/797-1
 
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10

The impact of air flow leakage on server inlet air temperat..:

, In: 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems,
 
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13

Selection of good medical journals for publication -an inno..:

Iyengar, Madhusudan M
Indian Journal of Community Health.  30 (2018)  2 - p. 166-169 , 2018
 
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