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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
1
Moving Towards Microchannel-based Chip Cooling:
, In:
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2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ,
5
Mechanical Design and Reliability of Gold-Tin Eutectic Bond..:
, In:
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Encyclopedia of thermal packaging : a guide to cooling of electronic equipment; [Set 2:] / editor-in-chief: Avram Bar-Cohen ,
8
Cooling of microelectronic and nanoelectronic equipment
Thermal packaging toolsVol. 1:
, In: , In:advances and emerging research
Copies:
Zentrale:E02 h elt 688 m/797-1
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2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems ,
10