Izard, Santiago González
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1

NextMed, Augmented and Virtual Reality platform for 3D medi..:

, In: Proceedings of the Seventh International Conference on Technological Ecosystems for Enhancing Multiculturality,
 
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NextMed : How to enhance 3D radiological images with Aug..:

, In: Proceedings of the Sixth International Conference on Technological Ecosystems for Enhancing Multiculturality,
 
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360° vision applications for medical training:

, In: Proceedings of the 5th International Conference on Technological Ecosystems for Enhancing Multiculturality,
 
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5

Virtual Simulation for Scoliosis Surgery:

, In: Proceedings of the 5th International Conference on Technological Ecosystems for Enhancing Multiculturality,
 
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Virtual reality medical training system:

, In: Proceedings of the Fourth International Conference on Technological Ecosystems for Enhancing Multiculturality,
 
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8

The Metaverse in Medical Education and Clinical Practice:

, In: Proceedings TEEM 2022: Tenth International Conference on Technological Ecosystems for Enhancing Multiculturality; Lecture Notes in Educational Technology,
 
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App Design and Implementation for Learning Human Anatomy Th..:

, In: Radical Solutions and eLearning; Lecture Notes in Educational Technology,
 
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11

Virtual Reality In Higher Education: An Experience With Med..:

, In: Eighth International Conference on Technological Ecosystems for Enhancing Multiculturality,
 
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NextMed, Augmented and Virtual Reality platform for 3D medi..:

Izard, Santiago González ; Plaza, Óscar Alonso ; Torres, Ramiro Sánchez..
S. González-Izard, Ó. Alonso Plaza, R. Sánchez Torres, J. A. Juanes-Méndez and F. J. García-Peñalvo, "NextMed, Augmented and Virtual Reality platform for 3D medical imaging visualization," in TEEM'19 Proceedings of the Seventh International Conference on Technological Ecosystems for Enhancing Multiculturality (Leon, Spain, October 16th-18th, 2019), M. Á. Conde-González, F. J. Rodríguez-Sedano, C. Fernández-Llamas and F. J. García-Peñalvo, Eds. ICPS: ACM International Conference Proceedings Series, pp. 459-467, New York, NY, USA: ACM, 2019. doi:10.1145/3362789.3362936..  , 2019
 
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