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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
3
Multi-layer FCCSP organic packaging for D-band millimeter w..:
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2022 International Electron Devices Meeting (IEDM) ,
4
Enabling Next Generation 3D Heterogeneous Integration Archi..:
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2019 IEEE International Electron Devices Meeting (IEDM) ,
6