Jain, D. C.
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2

Interfacial reactions between liquid Sn3.5Ag0.5Cu solders a..:

Wu, R. W. ; Tsao, L. C. ; Chang, S. Y...
Journal of Materials Science: Materials in Electronics.  22 (2010)  8 - p. 1181-1187 , 2010
 
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The Inhibition of Tin Whiskers on the Surface of Sn-8Zn-3Bi..:

Jain, C. C. ; Chen, C. L. ; Lai, H. J..
Journal of Materials Engineering and Performance.  20 (2010)  6 - p. 1043-1048 , 2010
 
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Intermetallic Compounds Formed in In-3Ag Solder BGA Package..:

Chuang, T. H. ; Jain, C. C. ; Wang, S. S.
Journal of Materials Engineering and Performance.  18 (2009)  8 - p. 1133-1139 , 2009
 
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Intermetallic Compounds Formed in Sn-20In-2.8Ag Solder BGA ..:

Jain, C.C. ; Wang, S.S. ; Huang, K.W..
Journal of Materials Engineering and Performance.  18 (2008)  2 - p. 211-215 , 2008
 
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Intermetallic Reactions in Sn-0.4Co-0.7Cu Solder BGA Packag..:

Chuang, T.H. ; Jain, C.C. ; Wu, H.M.
Journal of Electronic Materials.  37 (2008)  11 - p. 1734-1741 , 2008
 
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A generalized neyman's type a contribution for the busy per..:

Jain, C.C.
Communications in Statistics.  4 (1975)  11 - p. 1065-1071 , 1975
 
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11

Design studies and intelligence engineering: proceedings of.. 

Frontiers in Artificial Intelligence and Applications, volume 365
 
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A Novel Method to Prevent Extreme Whole-body Vibration to M..:

, In: 2023 IEEE International Conference on Industrial Engineering and Engineering Management (IEEM),
Verma, T. ; Gupta, S. ; Jain, C. - p. 0828-0832 , 2023
 
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14

Physica status solidi 

Volume 82, Number 2: April 16  Physica status solidi ; Volume 82, Number 2, A
Alario-Franco, M. A ; Anstis, G. R ; Atzkodt, V... - Reprint 2021 . , [2022]
 
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Preface:

Cristani, M ; Toro, C ; Zanni-Merk, C..
Procedia Computer Science.  207 (2022)  - p. 1-12 , 2022
 
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