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Springer Proceedings in Physics; Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium ,
8
Thermal Management on the Solder Joints of Adjacent Ball Gr..:
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2023 International Conference on Mechatronics, IoT and Industrial Informatics (ICMIII) ,
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Study on Forming and Properties of Heat Resistant Low Expan..:
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10
Proceedings of the 7th International Corrosion Prevention S..
Lecture Notes in Mechanical Engineering
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TENCON 2023 - 2023 IEEE Region 10 Conference (TENCON) ,
12
Effect of Ultrasonic Process Parameter on Resistance and Pl..:
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2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ,
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Measurement of Aluminium Remnant Thickness on Copper Wire B..:
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Springer Proceedings in Physics; Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium ,
15