Jason Kian Seng Lee
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1

The impact of orbital bony or fat decompression on the outc..:

Lee, Jason Kian Seng ; Hsieh, Chen ; Wei, Yi-Hsuan.
Journal of the Formosan Medical Association.  118 (2019)  1 - p. 387-394 , 2019
 
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2

Integrated and Stepwise Epicanthoplasty Combined with Bleph..:

Lin, Yanyan ; Chen, Ben ; Woo, David M....
Aesthetic Plastic Surgery.  43 (2019)  5 - p. 1235-1240 , 2019
 
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3

Optimizing esthetic outcomes in graded full-thickness anter..:

Lee, Jason Kian Seng ; Loi, Mei-Xue ; Wei, Yi-Hsuan.
Graefe's Archive for Clinical and Experimental Ophthalmology.  257 (2019)  6 - p. 1303-1308 , 2019
 
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5

The impact of orbital bony or fat decompression on the outc..:

Jason Kian Seng Lee ; Chen Hsieh ; Yi-Hsuan Wei.
http://www.sciencedirect.com/science/article/pii/S0929664618300846.  , 2019
 
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7

Tracking body core temperature in military thermal environm..:

, In: 2016 IEEE 13th International Conference on Wearable and Implantable Body Sensor Networks (BSN),
Seng, Kok-Yong ; Chen, Ying ; Chai, Kian Ming A.... - p. 296-299 , 2016
 
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8

Autonomous patrol and surveillance system using unmanned ae..:

, In: 2015 IEEE 15th International Conference on Environment and Electrical Engineering (EEEIC),
Lee, Kian Seng ; Ovinis, Mark ; Nagarajan, T... - p. 1291-1297 , 2015
 
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9

High-Frequency Characteristics of InGaP/GaAs Double Heteroj..:

Khai, Loke Wan ; Yue, Wang ; Kwang Hong, Lee...
IEEE Journal of the Electron Devices Society.  8 (2020)  - p. 122-125 , 2020
 
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11

Layer-transferred gallium arsenide heterojunction bipolar t..:

Wan Khai, Loke ; Yue, Wang ; Hanlin, Xie...
Materials Science and Engineering: B.  296 (2023)  - p. 116665 , 2023
 
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12

In0.3Ga0.7As heterojunction bipolar transistor grown on GeS..:

Loke, Wan Khai ; Wang, Yue ; Gao, Yu...
Materials Science in Semiconductor Processing.  146 (2022)  - p. 106663 , 2022
 
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13

A review of silicon-based wafer bonding processes, an appro..:

Bao, Shuyu ; Wang, Yue ; Lina, Khaw...
Journal of Semiconductors.  42 (2021)  2 - p. 023106 , 2021
 
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14

High brightness and bonding yield of integrated Si-CMOS and..:

, In: 2019 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S),
Lee, Kwang Hong ; Zhang, Lin ; Zhang, Li... - p. 1-3 , 2019
 
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