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Jeon, Choongpyo
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1

Investigation of Acceleration factors for SnAgCu-Bi Solder ..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Jeon, Choongpyo ; Choi, Youngsung ; Jeong, Hyunsik... - p. 846-851 , 2023
Link: https://doi.org/10.1109/..
 
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2

Investigation of Reflow Effect and Empirical Lifetime Model..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Seo, Kwangwon ; Rhew, Keunho ; Jeon, Choongpyo... - p. 1764-1769 , 2022
Link: https://doi.org/10.1109/..
 
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3

A New Method of Component-level ESD Test to Assess System-l..:

, In: 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC),
Jeon, Choongpyo ; Lim, Heonsang ; Jin, Jungho. - p. 681-684 , 2019
Link: https://doi.org/10.23919..
 
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4

A Radiation-Based Drive-Level ESD Test Method in Solid-Stat..:

, In: 2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE,
Jin, Jungho ; Kwon, Byungjin ; Heo, Jaeyoung... - p. 1128-1131 , 2019
Link: https://doi.org/10.1109/..
 
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