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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
3
Effect of Ceramic Filler in Epoxy Mold Compound on Thermome..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
4
RF Characterization in Range of 18GHz in Fan-out Package St..:
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2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) ,
15