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Jhong, Fong-Jyun
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1

High-quality AlN epilayers prepared by atomic layer deposit..:

Kao, Wei-Chung ; Jhong, Fong-Jyun ; Yin, Yu-Tung..
Materials Chemistry and Physics.  304 (2023)  - p. 127895 , 2023
Link: https://doi.org/10.1016/..
 
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2

Large area and rapid electron beam annealing for high-quali..:

Lee, Wei-Hao ; Jhong, Fong-Jyun ; Yin, Yu-Tung...
Materials Research Bulletin.  153 (2022)  - p. 111903 , 2022
Link: https://doi.org/10.1016/..
 
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3

Synthesis and morphological studies of a poly(5,6-difluorob..:

Wu, Jhong-Sian ; Jheng, Jyun-Fong ; Chang, Jen-Yun...
Polym. Chem..  5 (2014)  22 - p. 6472-6479 , 2014
Link: https://doi.org/10.1039/..
 
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4

Solar-driven hydrogen evolution in alkaline seawater over e..:

Lai, Yi-Hsuan ; Yeh, Pei-Wen ; Jhong, Meng-Jyun.
Chemical Engineering Journal.  475 (2023)  - p. 146413 , 2023
Link: https://doi.org/10.1016/..
 
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5

Characterization of oxide barrier layers prepared by atomic..:

Tsai, Fa-Ta ; Chao, Ching-Kong ; Jhong, Kai-Jyun.
Advances in Mechanical Engineering.  9 (2017)  7 - p. 168781401771180 , 2017
Link: https://doi.org/10.1177/..
 
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6

Isolation and characterization of lactic acid bacteria from..:

Chen, Yi-sheng ; Wu, Hui-chung ; Wang, Chiung-mei...
Folia Microbiologica.  58 (2012)  2 - p. 103-109 , 2012
Link: https://doi.org/10.1007/..
 
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7

High Speed D2D Interface Applied on Advanced Package:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Wang, Chen Chao ; Huang, Chih Yi ; Kuo, Hung Chun... - p. 269-270 , 2024
Link: https://doi.org/10.23919..
 
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8

A Low-Cost Antenna-in-Package (AiP) for D-Band Application:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Kuo, Hung-Chun ; Wu, Po-I ; Jhong, Ming-Fong.. - p. 481-486 , 2023
Link: https://doi.org/10.1109/..
 
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9

Mitigate Package Level Crosstalk Using Tabbed Design:

, In: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Tsai, Cheng-Yu ; Kuo, Hung-Chun ; Jhong, Ming-Fong. - p. 237-239 , 2023
Link: https://doi.org/10.1109/..
 
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10

Creative Design and Structure Applied to Chiplets Packaging:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Wang, Chen-Chao ; Huang, Chih-Yi ; Kuo, Hung-Chun... - p. 1353-1358 , 2023
Link: https://doi.org/10.1109/..
 
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11

Crosstalk Mitigation for High Speed SerDes Applications on ..:

, In: 2023 IEEE CPMT Symposium Japan (ICSJ),
Hung, Li-Chieh ; Kuo, Hung-Chun ; Jhong, Ming-Fong. - p. 160-163 , 2023
Link: https://doi.org/10.1109/..
 
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12

A planar High-efficient W-band Substrate-Integrated-Wavegui..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Lin, Yi-Ting ; Kuo, Hung-Chun ; Wu, Po-I... - p. 93-97 , 2022
Link: https://doi.org/10.1109/..
 
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13

A Study on Alternative Substrate for FCBGA:

, In: 2022 IEEE CPMT Symposium Japan (ICSJ),
Hung, Li-Chieh ; Wu, Po-I ; Kuo, Hung-Chun... - p. 134-137 , 2022
Link: https://doi.org/10.1109/..
 
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14

A Study of Material Extraction and Moisture Effect on mmWav..:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Kuo, Chiung-Ying ; Kuo, Hung-Chun ; Jhong, Ming-Fong. - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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15

Electrical Performance Analysis for Bridge Die Package Solu..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Pan, Po Chih ; Chu, Fu Cheng ; Kuo, Hung Chun... - p. 113-114 , 2022
Link: https://doi.org/10.23919..
 
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