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Jhong, Ming-Fong
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1

Creative Design and Structure Applied to Chiplets Packaging:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Wang, Chen-Chao ; Huang, Chih-Yi ; Kuo, Hung-Chun... - p. 1353-1358 , 2023
Link: https://doi.org/10.1109/..
 
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2

Mitigate Package Level Crosstalk Using Tabbed Design:

, In: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Tsai, Cheng-Yu ; Kuo, Hung-Chun ; Jhong, Ming-Fong. - p. 237-239 , 2023
Link: https://doi.org/10.1109/..
 
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3

A Low-Cost Antenna-in-Package (AiP) for D-Band Application:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Kuo, Hung-Chun ; Wu, Po-I ; Jhong, Ming-Fong.. - p. 481-486 , 2023
Link: https://doi.org/10.1109/..
 
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4

Crosstalk Mitigation for High Speed SerDes Applications on ..:

, In: 2023 IEEE CPMT Symposium Japan (ICSJ),
Hung, Li-Chieh ; Kuo, Hung-Chun ; Jhong, Ming-Fong. - p. 160-163 , 2023
Link: https://doi.org/10.1109/..
 
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5

A Study of Material Extraction and Moisture Effect on mmWav..:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Kuo, Chiung-Ying ; Kuo, Hung-Chun ; Jhong, Ming-Fong. - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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6

A Study on Alternative Substrate for FCBGA:

, In: 2022 IEEE CPMT Symposium Japan (ICSJ),
Hung, Li-Chieh ; Wu, Po-I ; Kuo, Hung-Chun... - p. 134-137 , 2022
Link: https://doi.org/10.1109/..
 
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7

A planar High-efficient W-band Substrate-Integrated-Wavegui..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Lin, Yi-Ting ; Kuo, Hung-Chun ; Wu, Po-I... - p. 93-97 , 2022
Link: https://doi.org/10.1109/..
 
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8

Extraction of Complex Permittivity of Dielectrics on Packag..:

, In: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC),
Lin, Yi-Ting ; Kuo, Hung-Chun ; Wu, Po-I... - p. 564-569 , 2021
Link: https://doi.org/10.1109/..
 
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9

High Speed SerDes Design on FOCoS with Thick RDL:

, In: 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Hung, Li-Chieh ; Wu, PO-I ; Kuo, Hung-Chun.. - p. 53-55 , 2020
Link: https://doi.org/10.1109/..
 
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10

Study on Temperature Impact of the Dielectric Material Loss..:

, In: 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC),
Kuo, Hung-Chun ; Jhong, Ming-Fong ; Wang, Chen-Chao - p. 289-292 , 2019
Link: https://doi.org/10.23919..
 
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11

Ultra High Density Package Design and Electrical Analysis i..:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),
Hsieh, Tsun-Lung ; Kuo, Hung-Chun ; Jhong, Ming-Fong.. - p. 457-460 , 2019
Link: https://doi.org/10.1109/..
 
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12

A 77GHz Antenna-in-Package with Low-Cost Solution for Autom..:

, In: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC),
Ho, Cheng-Yu ; Hsieh, Sheng-Chi ; Jhong, Ming-Fong.. - p. 191-196 , 2018
Link: https://doi.org/10.1109/..
 
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13

The Comparison of Package Design and Electrical Analysis in..:

, In: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC),
Hsieh, Tsun-Lung ; Chou, Yuan-Hsi ; Pan, Po-Chih... - p. 1855-1860 , 2017
Link: https://doi.org/10.1109/..
 
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14

High Speed D2D Interface Applied on Advanced Package:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Wang, Chen Chao ; Huang, Chih Yi ; Kuo, Hung Chun... - p. 269-270 , 2024
Link: https://doi.org/10.23919..
 
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15

Electrical Performance Analysis for Bridge Die Package Solu..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Pan, Po Chih ; Chu, Fu Cheng ; Kuo, Hung Chun... - p. 113-114 , 2022
Link: https://doi.org/10.23919..
 
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