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2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
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Mitigate Package Level Crosstalk Using Tabbed Design:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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Creative Design and Structure Applied to Chiplets Packaging:
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2023 IEEE CPMT Symposium Japan (ICSJ) ,
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Crosstalk Mitigation for High Speed SerDes Applications on ..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
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A planar High-efficient W-band Substrate-Integrated-Wavegui..:
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2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
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A Study of Material Extraction and Moisture Effect on mmWav..:
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2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ,
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Extraction of Complex Permittivity of Dielectrics on Packag..:
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2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC) ,
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Study on Temperature Impact of the Dielectric Material Loss..:
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2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ,
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A 77GHz Antenna-in-Package with Low-Cost Solution for Autom..:
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2017 IEEE 67th Electronic Components and Technology Conference (ECTC) ,
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The Comparison of Package Design and Electrical Analysis in..:
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Proceedings of the 2010 Asia and South Pacific Design Automation Conference ,
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Obstacle-aware longest path using rectangular pattern detou..:
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2024 International Conference on Electronics Packaging (ICEP) ,
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High Speed D2D Interface Applied on Advanced Package:
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2022 International Conference on Electronics Packaging (ICEP) ,
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