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Jiang, Jian-Yong
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1

Enhanced energy density in polyetherimide nanocomposite fil..:

Fan, Ming-Zhi ; Sun, Bin-Zhou ; Jiang, Jian-Yong..
Rare Metals.  42 (2023)  6 - p. 1912-1922 , 2023
Link: https://doi.org/10.1007/..
 
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2

High-throughput finite-element design of dielectric composi..:

Wang, Jia-Cheng ; Shen, Zhong-Hui ; Jiang, Jian-Yong...
Composites Science and Technology.  225 (2022)  - p. 109517 , 2022
Link: https://doi.org/10.1016/..
 
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3

Nanocatalyst-Assisted Fine Tailoring of Pore Structure in H..:

Dutta, Dipak ; Jiang, Jian-Yong ; Jamaluddin, Anif...
ACS Applied Materials & Interfaces.  11 (2019)  40 - p. 36560-36570 , 2019
Link: https://doi.org/10.1021/..
 
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4

Phase-field modeling and machine learning of electric-therm..:

Shen, Zhong-Hui ; Wang, Jian-Jun ; Jiang, Jian-Yong...
Nature Communications.  10 (2019)  1 - p. , 2019
Link: https://doi.org/10.1038/..
 
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5

Effective Approach for TSV Cu Plating Gap Fill Improvement:

Lin, Paul-Chang ; Li, Guang-Ning ; Jiang, Jian-Yong...
ECS Transactions.  52 (2013)  1 - p. 443-451 , 2013
Link: https://doi.org/10.1149/..
 
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6

Effective Approach for Hillock Defect Reduction in Cu Metal..:

Li, Guang-Ning ; Lin, Paul-Chang ; Jiang, Jian-Yong...
ECS Transactions.  44 (2012)  1 - p. 737-743 , 2012
Link: https://doi.org/10.1149/..
 
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7

Wafer Backside Arcing Prevention in SIP Ti/TiN Process:

Huang, Hupin ; Lin, Paul-Chang ; Gui, Kun...
ECS Transactions.  44 (2012)  1 - p. 505-509 , 2012
Link: https://doi.org/10.1149/..
 
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8

Connexin 43 Reverses Malignant Phenotypes of Glioma Stem Ce..:

Yu, Shi-Cang ; Xiao, Hua-Liang ; Jiang, Xue-Feng...
Stem Cells.  30 (2012)  2 - p. 108-120 , 2012
Link: https://doi.org/10.1002/..
 
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9

Fab Environment Effect on Crescent Pits Defect in Cu Metall..:

Kang, Xiao-Chun ; Lin, Paul-Chang ; He, Peng...
ECS Transactions.  44 (2012)  1 - p. 797-801 , 2012
Link: https://doi.org/10.1149/..
 
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10

Study on Al-Ge Bonding and Quality Improvement in CMEMS Pro..:

Gu, Athics ; Lin, Paul-Chang ; Chang, Vincent...
ECS Transactions.  44 (2012)  1 - p. 1393-1399 , 2012
Link: https://doi.org/10.1149/..
 
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11

Study on Defect Reduction and Yield Improvement of MIM Al D..:

Chang, Vincent ; Gu, Athics ; Li, Terry...
ECS Transactions.  44 (2012)  1 - p. 791-796 , 2012
Link: https://doi.org/10.1149/..
 
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12

Contact Resistance Study in MOCVD TiN Process:

Han, Jerry ; Li, Bigtree ; Zhang, Ji-Wei..
ECS Transactions.  44 (2012)  1 - p. 471-476 , 2012
Link: https://doi.org/10.1149/..
 
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13

Study on the Solution of via Bottom Void in 90nm Technology:

Zhou, Dong-Yi ; He, Peng ; Sun, Ri-Hui...
ECS Transactions.  44 (2012)  1 - p. 745-749 , 2012
Link: https://doi.org/10.1149/..
 
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14

Improving Copper Interconnect Reliability via Ta/Ti Based B..:

Hu, Xiao-Wen ; Lin, Paulchang ; Ma, Jenny..
ECS Transactions.  34 (2011)  1 - p. 775-780 , 2011
Link: https://doi.org/10.1149/..
 
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15

A Novel Approach for Electro Chemical Plating (ECP) Process..:

Sun, Ri-Hui ; Zhang, Ji-Wei ; Jiang, Jian-Yong...
ECS Transactions.  18 (2009)  1 - p. 677-680 , 2009
Link: https://doi.org/10.1149/..
 
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