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2023 24th International Conference on Electronic Packaging Technology (ICEPT) ,
6
Life Prediction of Solder Interconnects under Harsh Thermal..:
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2020 IEEE 9th Joint International Information Technology and Artificial Intelligence Conference (ITAIC) ,
14
Research on Application of Multi-station Continuous Wave Ra..:
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2020 9th Asia-Pacific Conference on Antennas and Propagation (APCAP) ,
15