E-LIB Suche - Ergebnisse für: Jiangbo Luo

1

A flexible composite heat sink embedded Ag microchannels fo..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),

Cai, Han ; Wu, Yongjin ; Xie, DongDong... - p. 722-726 , 2024

Link: https://doi.org/10.1109/..

2

A low power consumption fractal microchannel heat sink base..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),

Wu, Yongjin ; Ma, Changbei ; Luo, Jiangbo... - p. 1-5 , 2023

Link: https://doi.org/10.1109/..

3

Controlled alignment of supermoiré lattice in double-aligne..:

Hu, Junxiong ; Tan, Junyou ; Al Ezzi, Mohammed M....
Nature Communications. 14 (2023) 1 - p. , 2023

Link: https://doi.org/10.1038/..

4

Role of Laryngopharyngeal Reflux Changes in Children with A..:

Zhou, Yu ; Ma, Ruixia ; Luo, Jiangbo...
Evidence-Based Complementary and Alternative Medicine. 2023 (2023) 1 - p. , 2023

Link: https://doi.org/10.1155/..

5

Magnetic proximity effect at the interface of two-dimension..:

Hu, Junxiong ; Luo, Jiangbo ; Zheng, Yuntian...
Journal of Alloys and Compounds. 911 (2022) - p. 164830 , 2022

Link: https://doi.org/10.1016/..

6

A Comprehensive Analysis of Teacher's Professional Identity..:

Xu, Jiahui ; Luo, Jiangbo ; Khattak, Hasan Ali
Mobile Information Systems. 2022 (2022) - p. 1-11 , 2022

Link: https://doi.org/10.1155/..

7

A modified 360° netting vein bionic structure for enhancing..:

Sun, Yunna ; Wu, Yongjin ; Cai, Han...
Composites Part A: Applied Science and Manufacturing. 143 (2021) - p. 106276 , 2021

Link: https://doi.org/10.1016/..

8

A novel Conformal T/R Module Based on Low Loss Flexible Pri..:

, In: 2021 CIE International Conference on Radar (Radar),

Liu, Mifeng ; Zhou, Yi ; Tu, Zhenbin... - p. 2779-2782 , 2021

Link: https://doi.org/10.1109/..

9

A low void ratio and low stress potting technology for the ..:

, In: 2020 21st International Conference on Electronic Packaging Technology (ICEPT),

Luo, Jiangbo ; Wu, Weiwei ; Liu, Mifeng... - p. 1-5 , 2020

Link: https://doi.org/10.1109/..

10

Preparation and Characterization of High Thermal Conductivi..:

Luo, Jiangbo ; Wu, Yongpeng ; Sun, Yunna...
Applied Sciences. 9 (2019) 9 - p. 1962 , 2019

Link: https://doi.org/10.3390/..

11

Microstructure of Cu-diamond composites with near-perfect i..:

Wu, Yongpeng ; Sun, Yunna ; Luo, Jiangbo...
Materials Characterization. 150 (2019) - p. 199-206 , 2019

Link: https://doi.org/10.1016/..

12

Critical effect and enhanced thermal conductivity of Cu-dia..:

Wu, Yongpeng ; Luo, Jiangbo ; Wang, Yan...
Ceramics International. 45 (2019) 10 - p. 13225-13234 , 2019

Link: https://doi.org/10.1016/..

13

Modeling and Analysis of TSV Arrays with Different Ground a..:

Sun, Yating ; Luo, Jiangbo ; Ding, Guifu
Journal of Physics: Conference Series. 1087 (2018) - p. 052019 , 2018

Link: https://doi.org/10.1088/..

14

Fabrication and characterization of a low-cost interposer w..:

Luo, Jiangbo ; Wang, Guilian ; Sun, Yunna..
Journal of Micromechanics and Microengineering. 28 (2018) 12 - p. 125010 , 2018

Link: https://doi.org/10.1088/..

15

Plastic analysis for through silicon via with actual etchin..:

Sun, Yunna ; Kang, Dongwoo ; Zhang, Yazhou...
Microelectronics Reliability. 75 (2017) - p. 43-52 , 2017

Link: https://doi.org/10.1016/..