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Joo, Young‐Chang
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1

Bonding structure and dry etching characteristics in amorph..:

Kim, Hongik ; Kim, Unggi ; Hong, Deokgi...
Carbon.  226 (2024)  - p. 119218 , 2024
Link: https://doi.org/10.1016/..
 
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2

Indolocarbazole‐Based Small Molecule Cathode‐Active Materia..:

Park, Hyunji ; Kye, Hyojin ; Lee, Jong‐Sung...
ENERGY & ENVIRONMENTAL MATERIALS.  , 2024
Link: https://doi.org/10.1002/..
 
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3

Effect of Ag agglomeration-driven nanovoids formation on fa..:

Lee, Seongi ; Shin, Jae-Myeong ; Hyun, Jun Hyeok...
Journal of Materials Research and Technology.  29 (2024)  - p. 851-856 , 2024
Link: https://doi.org/10.1016/..
 
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4

Thermal and Electrical Properties Depending on the Bonding ..:

Hwang, Jae Young ; Kim, Dokyun ; Jang, Hyejin..
Electronic Materials Letters.  , 2024
Link: https://doi.org/10.1007/..
 
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5

Thermal Transport Properties of Hybrid Bonding With Passiva..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Kim, Hakjun ; Hwang, Jae Young ; Park, Sangwoo... - p. 1609-1612 , 2024
Link: https://doi.org/10.1109/..
 
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6

Predictive Synthesis of Transition Metal Carbide via Thermo..:

Oh, Sang-Ho ; Kim, Dohun ; Kim, Ji-Yong...
Journal of the American Chemical Society.  146 (2024)  26 - p. 17940-17955 , 2024
Link: https://doi.org/10.1021/..
 
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7

Understanding the Electrical Characteristics of Electrochem..:

Kim, Dokyun ; Kim, Unggi ; Choi, Sungjae.
Electronic Materials Letters.  , 2024
Link: https://doi.org/10.1007/..
 
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8

Thermomechanical Challenges of 2.5-D Packaging: A Review of..:

Kim, Hakjun ; Hwang, Jae Young ; Kim, Sarah Eunkyung..
IEEE Transactions on Components, Packaging and Manufacturing Technology.  13 (2023)  10 - p. 1624-1641 , 2023
Link: https://doi.org/10.1109/..
 
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9

Copper Bonding Technology in Heterogeneous Integration:

Lee, Yoon-Gu ; McInerney, Michael ; Joo, Young-Chang..
Electronic Materials Letters.  20 (2023)  1 - p. 1-25 , 2023
Link: https://doi.org/10.1007/..
 
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10

Unravelling rate-determining step and consequence of O2- or..:

Kim, Dong Ho ; Oh, Sang-Ho ; Ha, Heon Phil..
Applied Surface Science.  614 (2023)  - p. 156099 , 2023
Link: https://doi.org/10.1016/..
 
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11

Fast and Durable Nanofiber Mat Channel Organic Electrochemi..:

Oh, Seung-Hyun ; Oh, Minseok ; Lee, Seongi...
ACS Applied Materials & Interfaces.  15 (2023)  33 - p. 39614-39624 , 2023
Link: https://doi.org/10.1021/..
 
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12

Vertical Pattern of Interconnects to Bypass High Strain Nea..:

Lee, Jong-Sung ; Lee, Young-Joo ; Seol, Jaegeun..
Electronic Materials Letters.  20 (2023)  2 - p. 122-130 , 2023
Link: https://doi.org/10.1007/..
 
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13

Boron-doped amorphous carbon deposited by DC sputtering for..:

Kim, Sungtae ; Kim, Ung-gi ; Ryu, Jinseok...
Applied Surface Science.  637 (2023)  - p. 157895 , 2023
Link: https://doi.org/10.1016/..
 
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14

Effect of N doping on the microstructure and dry etch prope..:

Kim, Sungtae ; Jeong, Min-Woo ; Kim, Kuntae...
RSC Advances.  13 (2023)  3 - p. 2131-2139 , 2023
Link: https://doi.org/10.1039/..
 
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15

Stress Analysis of Tungsten Deposition in a 3D Trench Mold ..:

Lee, Jong-Sung ; Kim, Suncheul ; Han, Donghoon..
IEEE Access.  10 (2022)  - p. 100675-100681 , 2022
Link: https://doi.org/10.1109/..
 
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