Jose, Benedict San
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1

Integrating Chiplets using Chips First Ultra-High-Density F..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
 
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2

Deca & ASE M-Series Bridge Die Compensation & Adaptive Patt..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Sandstrom, Clifford ; Talain, Erick ; Olson, Timothy... - p. 797-803 , 2023
 
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3

Mask-less Laser Direct Imaging & Adaptive Patterning Soluti..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
 
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4

Reducing the Thermal Budget in Low-Temperature Polyimide Di..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Karim, Zia ; Song, Kay ; Sandstrom, Cliff... - p. 551-554 , 2022
 
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9

Lyotropic Chiral Nematic Liquid Crystalline Aliphatic Conju..:

San Jose, Benedict A. ; Matsushita, Satoshi ; Akagi, Kazuo
Journal of the American Chemical Society.  134 (2012)  48 - p. 19795-19807 , 2012
 
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12

Formulation optimisation and characterisation of azithromyc..:

Ramkanth S ; Aravind M ; Gayathri R...
International Journal of Research in Pharmaceutical Sciences.  12 (2021)  1 - p. 477-486 , 2021
 
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13

Preliminary Characterization and Comparison of Mucilage fro..:

Gayathri R ; Benedict Jose C ; Ramkanth S...
International Journal of Research in Pharmaceutical Sciences.  12 (2021)  1 - p. 487-496 , 2021
 
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15

List of contributors:

, In: Rehabilitation Robots for Neurorehabilitation in High-, Low-, and Middle-Income Countries,
Ad Adams, Ebenezer ; Adebowale, Akintunde ; Agrawal, Abha... - p. xxi-xxviii , 2024
 
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