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Jourdain, Anne
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1

Block level and package level thermal assessment for back s..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lofrano, Melina ; Oprins, Herman ; Cherman, Vladimir... - p. 1036-1043 , 2024
Link: https://doi.org/10.1109/..
 
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2

Impact of Sub-μm Wafer Thinning on Latch-Up Risk in DTCO/ST..:

Serbulova, Kateryna ; Chen, Shih-Hung ; Hellings, Geert...
IEEE Transactions on Electron Devices.  71 (2024)  4 - p. 2278-2283 , 2024
Link: https://doi.org/10.1109/..
 
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3

Thomas Coutrot et Coralie Perez, Redonner du sens au travai..:

Jourdain, Anne
Prix des jeunes auteurices 2023; Sociologie du travail.  66 (2024)  2 - p. , 2024
Link: https://doi.org/10.4000/..
 
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4

3D interconnects for quantum computing:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Derakhshandeh, Jaber ; Dangol, Anish ; Hussain, Tassawar... - p. 821-828 , 2024
Link: https://doi.org/10.1109/..
 
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5

Direct Die-to-Wafer Hybrid Bonding Using Plasma Diced Dies ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lin, Ye ; Bex, Pieter ; Kennes, Koen... - p. 40-44 , 2024
Link: https://doi.org/10.1109/..
 
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6

Excellent outcome of children/adolescents with primary medi..:

Dourthe, Marie Emilie ; Auperin, Anne ; Rigaud, Charlotte...
Haematologica.  , 2024
Link: https://doi.org/10.3324/..
 
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7

Nano-Through Silicon Vias (nTSV) for Backside Power Deliver..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Beyne, Eric ; Jourdain, Anne ; Beyer, Gerald - p. 1-2 , 2023
Link: https://doi.org/10.23919..
 
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8

Low-Frequency Noise and Border Traps in Irradiated nMOS and..:

Li, Kan ; Luo, Xuyi ; Rony, M. W....
IEEE Transactions on Nuclear Science.  70 (2023)  4 - p. 442-448 , 2023
Link: https://doi.org/10.1109/..
 
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9

Le succès entrepreneurial sur la plateforme marchande Etsy ..:

Jourdain, Anne
Technologies numériques et apprentissages; RESET.  12 (2023)  - p. , 2023
Link: https://doi.org/10.4000/..
 
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10

Low temperature SiCN as dielectric for hybrid bonding:

, In: 2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM),
Kumar Channam, Venkat Sunil ; Iacovo, Serena ; Walsby, Edward... - p. 1-3 , 2023
Link: https://doi.org/10.1109/..
 
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11

Integration of plasma dicing in the collective die to wafer..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Suhard, Samuel ; Kennes, Koen ; Bex, Pieter... - p. 144-149 , 2023
Link: https://doi.org/10.1109/..
 
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12

3D backside integration of FinFETs: Is there an impact on L..:

Simoen, Eddy ; Jourdain, Anne ; Claeys, Cor.
Solid-State Electronics.  207 (2023)  - p. 108724 , 2023
Link: https://doi.org/10.1016/..
 
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13

Buried Power Rails and Nano-Scale TSV: Technology Boosters ..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Jourdain, Anne ; Stucchi, Michele ; Van der Plas, Geert.. - p. 1531-1538 , 2022
Link: https://doi.org/10.1109/..
 
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14

(Invited) Innovations in Transistor Architecture and Device..:

Veloso, Anabela ; Eneman, Geert ; Simoen, Eddy...
ECS Transactions.  108 (2022)  2 - p. 31-42 , 2022
Link: https://doi.org/10.1149/..
 
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15

Direct Bonding Using Low Temperature SiCN Dielectrics:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Iacovo, Serena ; Nagano, Fuya ; Channam, Venkat Sunil Kumar... - p. 602-607 , 2022
Link: https://doi.org/10.1109/..
 
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