E-LIB Suche - Ergebnisse für: Jourdan, N.

1

Integrating 8nm Self-Aligned Tip-to-Tip to Enable 4-track S..:

, In: 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM),

Marien, P. ; Gonzalez, V. V. ; Choudhury, S.... - p. 1-3 , 2023

Link: https://doi.org/10.1109/..

2

Selective ALD Mo Deposition in 10nm Contacts:

, In: 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM),

van der Veen, Marleen H. ; Maes, J. W. ; Pedreira, O. Varela... - p. 1-3 , 2023

Link: https://doi.org/10.1109/..

3

Molybdenum Nitride as a Scalable and Thermally Stable pWFM ..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),

Arimura, H. ; Brus, S. ; Franco, J.... - p. 1-2 , 2023

Link: https://doi.org/10.23919..

4

Low Resistance Cu Vias for 24nm Pitch and Beyond:

, In: 2022 IEEE International Interconnect Technology Conference (IITC),

van der Veen, Marleen H. ; Pedreira, O. Varela ; Jourdan, N.... - p. 129-131 , 2022

Link: https://doi.org/10.1109/..

5

Enabling 3-level High Aspect Ratio Supervias for 3nm nodes ..:

, In: 2022 IEEE International Interconnect Technology Conference (IITC),

Montero, D. ; Vega-Gonzalez, V. ; Feurprier, Y.... - p. 48-50 , 2022

Link: https://doi.org/10.1109/..

6

Buried Power Rail Metal exploration towards the 1 nm Node:

, In: 2021 IEEE International Electron Devices Meeting (IEDM),

Gupta, A. ; Radisic, D. ; Maes, J. W.... - p. 22.5.1-22.5.4 , 2021

Link: https://doi.org/10.1109/..

7

Conjunctival mucous membrane colour as an indicator for the..:

Sargison, N.D. ; Mazeri, S. ; Gamble, L....
Preventive Veterinary Medicine. 186 (2021) - p. 105225 , 2021

Link: https://doi.org/10.1016/..

8

Exploring W-Cu hybrid dual damascene metallization for futu..:

, In: 2021 IEEE International Interconnect Technology Conference (IITC),

van der Veen, Marleen H. ; Pedreira, O. Varela ; Heylen, N.... - p. 1-3 , 2021

Link: https://doi.org/10.1109/..

9

Buried Power Rail Integration with Si FinFETs for CMOS Scal..:

, In: 2020 IEEE Symposium on VLSI Technology,

Gupta, A. ; Mertens, H. ; Tao, Z.... - p. 1-2 , 2020

Link: https://doi.org/10.1109/..

10

Dielectric Reliability Study of 21 nm Pitch Interconnects w..:

, In: 2020 IEEE International Reliability Physics Symposium (IRPS),

Lesniewska, A. ; Roussel, P.J. ; Tierno, D.... - p. 1-6 , 2020

Link: https://doi.org/10.1109/..

11

Hybrid Metallization with Cu in sub 30nm Interconnects:

, In: 2020 IEEE International Interconnect Technology Conference (IITC),

van der Veen, Marleen H. ; Soethoudt, J. ; Delabie, A.... - p. 16-18 , 2020

Link: https://doi.org/10.1109/..

12

Buried Power Rail Scaling and Metal Assessment for the 3 nm..:

, In: 2020 IEEE International Electron Devices Meeting (IEDM),

Gupta, A. ; Pedreira, O. Varela ; Tao, Z.... - p. 20.3.1-20.3.4 , 2020

Link: https://doi.org/10.1109/..

13

Cobalt and Ruthenium drift in ultra-thin oxides:

Tierno, D. ; Varela Pedreira, O. ; Wu, C....
Microelectronics Reliability. 100-101 (2019) - p. 113407 , 2019

Link: https://doi.org/10.1016/..

14

Exercise echocardiography in uncomplicated type 2 diabetic ..:

Schuster, I. ; Maufrais-Buisson, C. ; Krastevich, M....
Archives of Cardiovascular Diseases Supplements. 11 (2019) 2 - p. 234 , 2019

Link: https://doi.org/10.1016/..

15

Three-Layer BEOL Process Integration with Supervia and Self..:

, In: 2019 IEEE International Electron Devices Meeting (IEDM),

Vega-Gonzalez, V. ; Bekaert, J. ; Kesters, E.... - p. 19.3.1-19.3.4 , 2019

Link: https://doi.org/10.1109/..