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Kahng, Andrew. B.
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1

A Hybrid ECO Detailed Placement Flow for Improved Reduction..:

, In: Proceedings of the Great Lakes Symposium on VLSI 2024,
Kahng, Andrew B. ; Pramanik, Bodhisatta ; Woo, Mingyu - p. 390-396 , 2024
Link: https://dl.acm.org/doi/1..
 
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2

Panel Statement: EDA Needs at Advanced Technology Nodes:

, In: Proceedings of the 2024 International Symposium on Physical Design,
Kahng, Andrew B. - p. 63 ff. , 2024
Link: https://dl.acm.org/doi/1..
 
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3

Scalable Flip-Flop Clustering Using Divide and Conquer For ..:

, In: Proceedings of the Great Lakes Symposium on VLSI 2024,
Kahng, Andrew B. ; Kundu, Sayak ; Thumathy, Shreyas - p. 177-184 , 2024
Link: https://dl.acm.org/doi/1..
 
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4

K-SpecPart: Supervised Embedding Algorithms and Cut Overlay..:

Bustany, Ismail ; Kahng, Andrew B. ; Koutis, Ioannis..
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.  43 (2024)  4 - p. 1232-1245 , 2024
Link: https://doi.org/10.1109/..
 
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5

Solvers, Engines, Tools and Flows: The Next Wave for AI/ML ..:

, In: Proceedings of the 2024 International Symposium on Physical Design,
Kahng, Andrew B. - p. 117-124 , 2024
Link: https://dl.acm.org/doi/1..
 
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6

Hier-RTLMP: A Hierarchical Automatic Macro Placer for Large..:

Kahng, Andrew B. ; Varadarajan, Ravi ; Wang, Zhiang
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.  43 (2024)  5 - p. 1552-1565 , 2024
Link: https://doi.org/10.1109/..
 
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7

OpenROAD and CircuitOps: Infrastructure for ML EDA Research..:

, In: 2024 IEEE 42nd VLSI Test Symposium (VTS),
Chhabria, Vidya A. ; Jiang, Wenjing ; Kahng, Andrew B.... - p. 1-4 , 2024
Link: https://doi.org/10.1109/..
 
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8

SLO-ECO: Single-Line-Open Aware ECO Detailed Placement and ..:

, In: 2024 25th International Symposium on Quality Electronic Design (ISQED),
Jeon, Joong-Won ; Kahng, Andrew B. ; Kang, Jae-Hyun.. - p. 1-8 , 2024
Link: https://doi.org/10.1109/..
 
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9

PROBE3.0: A Systematic Framework for Design-Technology Path..:

Choi, Suhyeong ; Jung, Jinwook ; Kahng, Andrew B....
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.  43 (2024)  4 - p. 1218-1231 , 2024
Link: https://doi.org/10.1109/..
 
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10

The TILOS AI Institute: Integrating optimization and AI for..:

Kahng, Andrew B. ; Mazumdar, Arya ; Reeves, Jodi.
AI Magazine.  45 (2024)  1 - p. 54-60 , 2024
Link: https://doi.org/10.1002/..
 
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11

Invited Paper: IEEE CEDA DATC Emerging Foundations in IC Ph..:

, In: 2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD),
Jung, Jinwook ; Kahng, Andrew B. ; Kundu, Sayak.. - p. 1-7 , 2023
Link: https://doi.org/10.1109/..
 
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12

Invited Paper: The Inevitability of AI Infusion Into Design..:

, In: 2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD),
Hu, Jiang ; Kahng, Andrew B. - p. 1-7 , 2023
Link: https://doi.org/10.1109/..
 
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13

The 2023 MLCAD FPGA Macro Placement Benchmark Design Suite ..:

, In: 2023 ACM/IEEE 5th Workshop on Machine Learning for CAD (MLCAD),
Bustany, Ismail ; Gasparyan, Grigor ; Gupta, Amit... - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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14

An Effective Cost-Skew Tradeoff Heuristic for VLSI Global R..:

, In: 2023 24th International Symposium on Quality Electronic Design (ISQED),
Kahng, Andrew B. ; Thumathy, Shreyas ; Woo, Mingyu - p. 1-8 , 2023
Link: https://doi.org/10.1109/..
 
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15

Assessment of Reinforcement Learning for Macro Placement:

, In: Proceedings of the 2023 International Symposium on Physical Design,
Cheng, Chung-Kuan ; Kahng, Andrew B. ; Kundu, Sayak.. - p. 158-166 , 2023
Link: https://dl.acm.org/doi/1..
 
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