Kang, Hyejun
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2

Ultrasonic dispersion of nanocomposite solder for microelec..:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
 
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4

Ultrasonic-Assisted Dispersion of ZnO Nanoparticles to Sn-B..:

Rajendran, Sri Harini ; Kang, Hyejun ; Jung, Jae Pil
Journal of Materials Engineering and Performance.  30 (2021)  5 - p. 3167-3172 , 2021
 
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7

Recent Low Temperature Solder of SnBi and Its Bonding Chara..:

Kang, Hyejun ; Baek, Bumgyu ; Jung, Jae Pil
Journal of Welding and Joining.  38 (2020)  6 - p. 576-583 , 2020
 
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