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2022 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA) ,
7
Cooperative surface-activation strategy for low-temperature..:
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2021 22nd International Conference on Electronic Packaging Technology (ICEPT) ,
9
Low-temperature Cu/SiO2 hybrid bonding using a novel two-st..:
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2020 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA) ,
10
Low-temperature direct and indirect bonding using plasma ac..:
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2020 21st International Conference on Electronic Packaging Technology (ICEPT) ,
13
Low-temperature bonding and interfacial failure behavior of..:
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2019 20th International Conference on Electronic Packaging Technology(ICEPT) ,
15