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Kang, Qiushi
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1

Wafer-level InP-Si covalent bonding and defect-free heteroi..:

Kang, Qiushi ; Niu, Fanfan ; Li, Ge...
Applied Surface Science.  670 (2024)  - p. 160614 , 2024
Link: https://doi.org/10.1016/..
 
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2

Plasma activated titanium-based bonding for robust and reli..:

Niu, Fanfan ; Yang, Shuhan ; Yuan, Xiaohui...
Ceramics International.  50 (2024)  14 - p. 25182-25191 , 2024
Link: https://doi.org/10.1016/..
 
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3

Room-temperature bonding of glass chips via PTFE-assisted p..:

Kang, Qiushi ; Wang, Chenxi ; Liu, Kaimeng.
Lab on a Chip.  23 (2023)  12 - p. 2710-2719 , 2023
Link: https://doi.org/10.1039/..
 
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4

Recent Advances on GaN-Based Micro-LEDs:

Zhang, Youwei ; Xu, Ruiqiang ; Kang, Qiushi..
Micromachines.  14 (2023)  5 - p. 991 , 2023
Link: https://doi.org/10.3390/..
 
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5

Research Progress of AlGaN-Based Deep Ultraviolet Light-Emi..:

Xu, Ruiqiang ; Kang, Qiushi ; Zhang, Youwei..
Micromachines.  14 (2023)  4 - p. 844 , 2023
Link: https://doi.org/10.3390/..
 
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6

Surface co-hydrophilization via ammonia inorganic strategy ..:

Kang, Qiushi ; Li, Ge ; Li, Zhengda..
Journal of Materials Science & Technology.  149 (2023)  - p. 161-166 , 2023
Link: https://doi.org/10.1016/..
 
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7

Cooperative surface-activation strategy for low-temperature..:

, In: 2022 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA),
Kang, Qiushi ; Li, Ge ; Niu, Fanfan. - p. 40-41 , 2022
Link: https://doi.org/10.1109/..
 
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8

Low-Temperature Co-hydroxylated Cu/SiO2 Hybrid Bonding Stra..:

Kang, Qiushi ; Wang, Chenxi ; Zhou, Shicheng...
ACS Applied Materials & Interfaces.  13 (2021)  32 - p. 38866-38876 , 2021
Link: https://doi.org/10.1021/..
 
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9

Low-temperature Cu/SiO2 hybrid bonding using a novel two-st..:

, In: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT),
Kang, Qiushi ; Wang, Chenxi ; Li, Ge.. - p. 1-5 , 2021
Link: https://doi.org/10.1109/..
 
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10

Low-temperature direct and indirect bonding using plasma ac..:

, In: 2020 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA),
Zhou, Shicheng ; Qi, Xiaoyun ; Kang, Qiushi. - p. 130-132 , 2020
Link: https://doi.org/10.1109/..
 
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11

Rapid pressureless and low-temperature bonding of large-are..:

Fang, Hui ; Wang, Chenxi ; Zhou, Shicheng...
Journal of Materials Science: Materials in Electronics.  31 (2020)  8 - p. 6497-6505 , 2020
Link: https://doi.org/10.1007/..
 
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12

Single-crystalline SiC integrated onto Si-based substrates ..:

Kang, Qiushi ; Wang, Chenxi ; Niu, Fanfan...
Ceramics International.  46 (2020)  14 - p. 22718-22726 , 2020
Link: https://doi.org/10.1016/..
 
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13

Low-temperature bonding and interfacial failure behavior of..:

, In: 2020 21st International Conference on Electronic Packaging Technology (ICEPT),
Kang, Qiushi ; Wang, Chenxi ; Zhou, Shicheng.. - p. 1-4 , 2020
Link: https://doi.org/10.1109/..
 
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14

A facile method for direct bonding of single-crystalline Si..:

Wang, Chenxi ; Xu, Jikai ; Guo, Shu...
Applied Surface Science.  471 (2019)  - p. 196-204 , 2019
Link: https://doi.org/10.1016/..
 
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15

Pressureless Low-Temperature Sintering of Silver Nano-Solde..:

, In: 2019 20th International Conference on Electronic Packaging Technology(ICEPT),
Wang, Te ; Wang, Chenxi ; Fang, Hui... - p. 1-3 , 2019
Link: https://doi.org/10.1109/..
 
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