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Kangasvieri, T
15
results:
Search for persons
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Format
Online (15)
Mediatypes
Articles (Online) (11)
OpenAccess-fulltext (4)
Languages
english (14)
finnish (1)
Sorted by: Relevance
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?
1
Enhanced thermal fatigue endurance and lifetime prediction ..:
Nousiainen, O.
;
Salmela, O.
;
Putaala, J.
.
Soldering & Surface Mount Technology. 23 (2011) 2 - p. 104-114 , 2011
Link:
https://doi.org/10.1108/..
?
2
Thermal fatigue endurance of Sn3Ag0.5Cu0.5In0.05Ni and Sn2...:
Nousiainen, O.
;
Kangasvieri, T.
;
Rautioaho, R.
.
Soldering & Surface Mount Technology. 23 (2011) 1 - p. 30-39 , 2011
Link:
https://doi.org/10.1108/..
?
3
Effect of ENIG deposition on the failure mechanisms of ther..:
Nousiainen, O.
;
Kangasvieri, T.
;
Kautio, K.
..
Soldering & Surface Mount Technology. 22 (2010) 3 - p. 22-35 , 2010
Link:
https://doi.org/10.1108/..
?
4
Characterization of Sn7In4.1Ag0.5Cu solder in lead‐free com..:
Nousiainen, O.
;
Kangasvieri, T.
;
Rautioaho, R.
.
Soldering & Surface Mount Technology. 20 (2008) 3 - p. 11-17 , 2008
Link:
https://doi.org/10.1108/..
?
5
Low‐loss and broadband BGA package transition for LTCC‐SiP ..:
Kangasvieri, T.
;
Halme, J.
;
Vähäkangas, J.
.
Microwave and Optical Technology Letters. 50 (2008) 4 - p. 1036-1040 , 2008
Link:
https://doi.org/10.1002/..
?
6
Thermal fatigue endurance of collapsible 95.5Sn4Ag0.5Cu sph..:
Nousiainen, O.
;
Lehtiniemi, L.
;
Kangasvieri, T.
..
Microelectronics Reliability. 48 (2008) 4 - p. 622-630 , 2008
Link:
https://doi.org/10.1016/..
?
7
Failure Mechanisms of Thermomechanically Loaded SnAgCu/Plas..:
NOUSIAINEN, O.
;
PUTAALA, J.
;
KANGASVIERI, T.
..
Journal of Electronic Materials. 36 (2007) 3 - p. 232-241 , 2007
Link:
https://doi.org/10.1007/..
?
8
Reliability and RF performance of BGA solder joints with pl..:
Kangasvieri, T.
;
Nousiainen, O.
;
Putaala, J.
..
Microelectronics Reliability. 46 (2006) 8 - p. 1335-1347 , 2006
Link:
https://doi.org/10.1016/..
?
9
Miniaturized low‐loss Wilkinson power divider for RF front‐..:
Kangasvieri, T.
;
Hautajärvi, I.
;
Jantunen, H.
.
Microwave and Optical Technology Letters. 48 (2006) 4 - p. 660-663 , 2006
Link:
https://doi.org/10.1002/..
?
10
Metallurgical reactions in composite 90Pb10Sn/lead-free sol..:
Nousiainen, O.
;
Putaala, J.
;
Kangasvieri, T.
..
Journal of Electronic Materials. 35 (2006) 10 - p. 1857-1865 , 2006
Link:
https://doi.org/10.1007/..
?
11
Design aspects of microwave components with LTCC technique:
Jantunen, H.
;
Kangasvieri, T.
;
Vähäkangas, J.
.
Journal of the European Ceramic Society. 23 (2003) 14 - p. 2541-2548 , 2003
Link:
https://doi.org/10.1016/..
?
12
Kieli-, kulttuuri- ja katsomustietoisuus koulutuksen ja kas..:
Alisaari, J
;
Bergroth, Mari
;
Kangasvieri, T
..
Alisaari , J , Bergroth , M , Kangasvieri , T , Moate , J & Viinikainen , T 2020 , ' Kieli-, kulttuuri- ja katsomustietoisuus koulutuksen ja kasvatuksen kentällä. ' , Kieli, Koulutus Ja Yhteiskunta , vol. 11 , no. 3 , pp. – .. , 2020
Link:
https://research.abo.fi/..
?
13
Effect of voids on thermomechanical cracking in lead-free S..:
Hagberg, J. (Juha)
;
Nousiainen, O. (Olli)
;
Putaala, J. (Jussi)
... , 2020
Link:
http://urn.fi/urn:nbn:fi..
?
14
Power module interconnection reliability in BTS application:
Putaala, J. (Jussi)
;
Hagberg, J. (Juha)
;
Kangasvieri, T. (Tero)
... , 2019
Link:
http://urn.fi/urn:nbn:fi..
?
15
Surface-mountable LTCC-SiP module approach for reliable RF ..:
Kangasvieri, T. (Tero)
info:eu-repo/semantics/altIdentifier/pissn/0355-3213. , 2008
Link:
http://urn.fi/urn:isbn:9..
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