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Karnam, Dileep
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1

Spray mist-assisted drilling of through silicon vias (TSV) ..:

Karnam, Dileep ; Lo, Yu-Lung ; Yang, Chia-Hua
Journal of Materials Research and Technology.  31 (2024)  - p. 679-688 , 2024
Link: https://doi.org/10.1016/..
 
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2

Plasma mediated ns-laser erosion of SiC monitored using Ram..:

Karnam, Dileep ; Rouhani, Mehdi ; Hobley, Jonathan...
Surfaces and Interfaces.  46 (2024)  - p. 104062 , 2024
Link: https://doi.org/10.1016/..
 
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3

Simulation study and parameter optimization of laser TSV us..:

Karnam, Dileep ; Lo, Yu-Lung ; Yang, Chia-Hua
Journal of Materials Research and Technology.  25 (2023)  - p. 3712-3727 , 2023
Link: https://doi.org/10.1016/..
 
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4

Simulation study and parameter optimization of laser TSV us..:

Dileep Karnam ; Yu-Lung Lo ; Chia-Hua Yang
http://www.sciencedirect.com/science/article/pii/S2238785423014473.  , 2023
Link: https://doi.org/10.1016/..
 
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