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Katakamsetty, Ushasree
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Integrated Wafer and Die Level Simulation of Back End of Li..:

, In: 2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM),
Katakamsetty, Ushasree ; Voykov, Stefan Nikolaev ; Vasilev, Boris... - p. 1-3 , 2023
Link: https://doi.org/10.1109/..
 
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A Study of Pattern Density and Process Variations Impact on..:

, In: 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),
Chen, Qian ; Tan, Juan Boon ; Xie, Lanfei... - p. 1-3 , 2018
Link: https://doi.org/10.1109/..
 
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