Kaushal, Arun
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2

What drives the investment intentions of emerging economy m..:

Dogra, Pallavi ; Kaushal, Arun ; Kalia, Prateek
Journal of Financial Services Marketing.  29 (2023)  2 - p. 276-291 , 2023
 
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3

Prioritization of erosion susceptible watersheds using morp..:

Sharma, Navneet ; Kaushal, Arun ; Yousuf, Abrar...
Watershed Ecology and the Environment.  5 (2023)  - p. 209-224 , 2023
 
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4

Geospatial technology for assessment of soil erosion and pr..:

Sharma, Navneet ; Kaushal, Arun ; Yousuf, Abrar...
Environmental Science and Pollution Research.  30 (2022)  1 - p. 515-531 , 2022
 
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5

The impact of Digital Marketing and Promotional Strategies ..:

Dogra, Pallavi ; Kaushal, Arun
Journal of Marketing Communications.  29 (2022)  4 - p. 403-430 , 2022
 
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6

Temporal Land-Use/Land-Cover Change Analysis in Kotla Sub-W..:

Digra, Amritpal ; Kaushal, Arun ; Loshali, D. C...
Journal of the Indian Society of Remote Sensing.  50 (2022)  7 - p. 1371-1391 , 2022
 
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7

Antecedents of the Youngster's Awareness About Financial Li..:

Dogra, Pallavi ; Kaushal, Arun ; Sharma, Rishi Raj
Vision: The Journal of Business Perspective.  27 (2021)  1 - p. 48-62 , 2021
 
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8

Underlying the triple burden effects on women educationists..:

Dogra, Pallavi ; Kaushal, Arun
Education and Information Technologies.  27 (2021)  1 - p. 209-228 , 2021
 
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9

An Investigation of Indian Generation Z Adoption of the Voi..:

Dogra, Pallavi ; Kaushal, Arun
Journal of Promotion Management.  27 (2021)  5 - p. 673-696 , 2021
 
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11

Evaluation of thermal performance of single pass earth–air ..:

Deldan, Namgial ; Rajan, Aggarwal ; Hans, Vishavjeet S..
Environmental Progress & Sustainable Energy.  36 (2017)  4 - p. 1253-1261 , 2017
 
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12

Enhancing Defect Detection Using Lock In Thermography:

, In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
 
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14

Thermal Test Vehicle for HPC – System Level Approach for In..:

, In: 2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC),
 
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