Kepa, J.
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5

Dangling bond defects in silicon-passivated strained-Si1−xG..:

Madia, O. ; Kepa, J. ; Afanas'ev, V. V....
Journal of Materials Science: Materials in Electronics.  31 (2019)  1 - p. 75-79 , 2019
 
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6

Analysis of the differential emission measure distributions..:

Kepa, A. ; Sylwester, B. ; Sylwester, J...
Journal of Atmospheric and Solar-Terrestrial Physics.  179 (2018)  - p. 545-552 , 2018
 
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8

Structural damage in thin SLIM-Cut c-Si foils fabricated fo..:

Kepa, J ; Martini, R ; Stesmans, A
Semiconductor Science and Technology.  30 (2015)  11 - p. 115015 , 2015
 
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11

Generation of Si dangling bond defects at Si/insulator inte..:

Cerbu, F. ; Nguyen, A. P. D. ; Kepa, J...
physica status solidi (b).  251 (2014)  11 - p. 2193-2196 , 2014
 
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14

Effect of Binder Content in Cu–In–Se Precursor Ink on the P..:

Buffière, M. ; Zaghi, A. E. ; Lenaers, N....
The Journal of Physical Chemistry C.  118 (2014)  47 - p. 27201-27209 , 2014
 
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