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Khatir, Z.
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1

New model of crack propagation of aluminium wire bonds in I..:

Halouani, A. ; Khatir, Z. ; Lallemand, R...
Microelectronics Reliability.  147 (2023)  - p. 115066 , 2023
Link: https://doi.org/10.1016/..
 
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2

Physicochemical-microstructural approach for modeling the c..:

, In: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Shqair, M. ; Khatir, Z. ; Ibrahim, A.... - p. 1-6 , 2022
Link: https://doi.org/10.1109/..
 
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3

Finite elements analyses of early-stage crack propagation i..:

Halouani, A. ; Shqair, M. ; Khatir, Z...
Microelectronics Reliability.  138 (2022)  - p. 114610 , 2022
Link: https://doi.org/10.1016/..
 
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4

A combined physicochemical-microstructural approach to pred..:

Shqair, M. ; Khatir, Z. ; Ibrahim, A....
Microelectronics Reliability.  132 (2022)  - p. 114516 , 2022
Link: https://doi.org/10.1016/..
 
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5

Computational fluid dynamics analysis and optimisation of p..:

Hamad, Hazim S. ; Kapur, N. ; Khatir, Z....
Applied Thermal Engineering.  183 (2021)  - p. 116122 , 2021
Link: https://doi.org/10.1016/..
 
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6

Robust Optimisation of Serpentine Fluidic Heat Sinks for Hi..:

, In: Advances in Heat Transfer and Thermal Engineering,
Ismaeel, Muyassar E. ; Kapur, N. ; Khatir, Z.. - p. 583-590 , 2021
Link: https://doi.org/10.1007/..
 
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7

CFD-Enabled Optimization of Polymerase Chain Reaction Therm..:

, In: Advances in Heat Transfer and Thermal Engineering,
Hamad, Hazim S. ; Kapur, N. ; Khatir, Z.... - p. 409-416 , 2021
Link: https://doi.org/10.1007/..
 
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8

Using of bond-wire resistance as aging indicator of semicon..:

Ibrahim, A. ; Khatir, Z. ; Ousten, J.P....
Microelectronics Reliability.  114 (2020)  - p. 113757 , 2020
Link: https://doi.org/10.1016/..
 
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9

Thermal behaviour evolution of an IGBT module after aging m..:

Metayrek, Y. ; Kociniewski, T. ; Khatir, Z.
Microelectronics Reliability.  114 (2020)  - p. 113843 , 2020
Link: https://doi.org/10.1016/..
 
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10

Thermal mapping at the cell level of chips in power modules..:

Metayrek, Y. ; Kociniewski, T. ; Khatir, Z.
Microelectronics Reliability.  105 (2020)  - p. 113563 , 2020
Link: https://doi.org/10.1016/..
 
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11

Analysis of the aging mechanism occurring at the bond-wire ..:

Dornic, N. ; Ibrahim, A. ; Khatir, Z....
Microelectronics Reliability.  114 (2020)  - p. 113873 , 2020
Link: https://doi.org/10.1016/..
 
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12

Wire-bond contact degradation modeling for remaining useful..:

Nazar, M. ; Ibrahim, A. ; Khatir, Z...
Microelectronics Reliability.  114 (2020)  - p. 113824 , 2020
Link: https://doi.org/10.1016/..
 
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13

Effect of power cycling tests on traps under the gate of Al..:

Elharizi, M. ; Zaki, F. ; Ibrahim, A...
Microelectronics Reliability.  88-90 (2018)  - p. 671-676 , 2018
Link: https://doi.org/10.1016/..
 
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14

Theoretical investigation of the charges weight between int..:

Zaki, F. ; Khatir, Z. ; Escoffier, R..
Journal of Computational Electronics.  17 (2018)  3 - p. 1220-1228 , 2018
Link: https://doi.org/10.1007/..
 
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15

Analysis of the degradation mechanisms occurring in the top..:

Dornic, N. ; Ibrahim, A. ; Khatir, Z....
Microelectronics Reliability.  88-90 (2018)  - p. 462-469 , 2018
Link: https://doi.org/10.1016/..
 
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