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Kiat Goh, Simon Chun
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1

Design and Fabrication of 2.5D Cryogenic Interposer With In..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Li, HongYu ; Chui, King-Jien ; Kiat Goh, Simon Chun... - p. 458-463 , 2024
Link: https://doi.org/10.1109/..
 
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2

Digital metabolic activity assay enables fast assessment of..:

Wu, Wenshuai ; Kiat Goh, Simon Chun ; Cai, Gaozhe..
Analytica Chimica Acta.  1285 (2024)  - p. 342007 , 2024
Link: https://doi.org/10.1016/..
 
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3

A Precise Wafer Thinning Integration Process for nano-TSV F..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Tseng, Ya-Ching ; Kiat Goh, Simon Chun ; Darshini, Senthilkumar... - p. 1170-1174 , 2023
Link: https://doi.org/10.1109/..
 
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4

Room Temperature Plasma-Enhanced Niobium-Niobium Wafer Bond..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Kiat Goh, Simon Chun ; Hemanth Kumar, Cheemalamarri ; Hu, Liangxing... - p. 404-408 , 2023
Link: https://doi.org/10.1109/..
 
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5

Comparative Study of Die-Attach Materials for LED Die Bondi..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Hu, Liangxing ; Bao, Shuyu ; Wang, Yue... - p. 447-451 , 2022
Link: https://doi.org/10.1109/..
 
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6

A Wafer Scale Hybrid Integration Platform for Co-packaged P..:

, In: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Venkatesan, Suresh ; Lee, James ; Kiat Goh, Simon Chun... - p. 381-382 , 2022
Link: https://doi.org/10.1109/..
 
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7

Mid Infrared Volatile Compounds Detection Using Thermally R..:

, In: 2019 IEEE SENSORS,
Kiat Goh, Simon Chun ; Chuan, KaiLiang ; Lee, Chengkuo. - p. 1-4 , 2019
Link: https://doi.org/10.1109/..
 
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8

Electrical Characterization and Reliability Studies of Nano..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Tseng, Ya-Ching ; Chui, King-Jien ; Goh, Simon Chun Kiat... - p. 1581-1586 , 2024
Link: https://doi.org/10.1109/..
 
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9

Multi-Axial Elastic Averaging for Sub-Micron Passive Alignm..:

Goh, Simon Chun Kiat ; Siah, Chun Fei ; Xu, Baochang...
Journal of Lightwave Technology.  41 (2023)  12 - p. 3986-3992 , 2023
Link: https://doi.org/10.1109/..
 
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10

2.5D Technology based on Vertically Aligned Carbon Nanotube..:

, In: 2023 IEEE/MTT-S International Microwave Symposium - IMS 2023,
Chun Kiat Goh, Simon ; Fei Siah, Chun ; De Saxce, Joseph... - p. 767-770 , 2023
Link: https://doi.org/10.1109/..
 
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11

Development of Nitride-Based Optical Phased Array at 1092 n..:

Lim, Yu Dian ; Goh Chun Kiat, Simon ; Seit, Wen Wei...
IEEE Photonics Technology Letters.  35 (2023)  16 - p. 855-857 , 2023
Link: https://doi.org/10.1109/..
 
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12

Plasma-Activated Cu-Cu and Al-Al Direct Bonding for Electro..:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Hu, Liangxing ; Goh, Simon Chun Kiat ; Lim, Yu Dian... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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13

Monolithic Germanium-Tin Pedestal Waveguide for Mid-Infrare..:

Goh, Simon Chun Kiat ; Shiau, Li Lynn ; Zhang, Lin...
IEEE Photonics Journal.  13 (2021)  2 - p. 1-11 , 2021
Link: https://doi.org/10.1109/..
 
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14

Time-Dependent Evolution Study of Ar/N2 Plasma-Activated Cu..:

Hu, Liangxing ; Goh, Simon Chun Kiat ; Tao, Jing...
ECS Journal of Solid State Science and Technology.  10 (2021)  12 - p. 124001 , 2021
Link: https://doi.org/10.1149/..
 
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15

Effects of high-temperature thermal annealing on GeSn thin-..:

Wu, Shaoteng ; Son, Bongkwon ; Zhang, Lin...
Journal of Alloys and Compounds.  872 (2021)  - p. 159696 , 2021
Link: https://doi.org/10.1016/..
 
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