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Kim, Dae-Woo
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1

High Performance 3D Package Technology for Mobile Applicati..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Kim, Sun Jae ; Kim, Cheol ; Jang, Huiyeong... - p. 348-352 , 2024
Link: https://doi.org/10.1109/..
 
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2

A study on D2W Hybrid Cu bonding Technology for HBM Multi-d..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lee, Hyeonmin ; Kim, Jihoon ; Kim, Min-Ki... - p. 76-80 , 2024
Link: https://doi.org/10.1109/..
 
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3

Management of chronic rhinosinusitis with nasal polyps in t..:

Karpischenko, Sergey ; Jung, Yong Gi ; Kim, Dae-Woo...
Asia Pacific Allergy.  14 (2024)  2 - p. 77-83 , 2024
Link: https://doi.org/10.5415/..
 
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4

Extremely Large 3.5D Heterogeneous Integration for the Next..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Lee, Ilbok ; Nam, Soohyun ; Kim, Sungeun... - p. 893-898 , 2023
Link: https://doi.org/10.1109/..
 
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5

Die to Wafer Hybrid Cu Bonding for Fine Pitch 3D-IC Applica..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Kim, Yeongseon ; Kim, Juhyeon ; Kim, Hyoeun... - p. 1043-1047 , 2023
Link: https://doi.org/10.1109/..
 
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6

Adsorptive recovery of rare earth elements from aqueous sol..:

Kim, Hee Seo ; Kim, Dae-Woo ; Park, In-Su.
Journal of Cleaner Production.  418 (2023)  - p. 138189 , 2023
Link: https://doi.org/10.1016/..
 
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7

Process and Design Optimization for Hybrid Cu Bonding Void:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Kim, Hyoeun ; Kim, Juhyeon ; Kim, Yeongseon... - p. 194-197 , 2022
Link: https://doi.org/10.1109/..
 
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8

Reset First Resistive Switching in Ni1−xO Thin Films as Cha..:

Kim, Dae-woo ; Kim, Tae-ho ; Kim, Jae-yeon.
Nanomaterials.  12 (2022)  13 - p. 2231 , 2022
Link: https://doi.org/10.3390/..
 
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9

Advanced Chip Last Process Integration for Fan Out WLP:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Yoo, Taewon ; Lee, Seok Hyun ; Suk, Kyoung Lim... - p. 1371-1375 , 2022
Link: https://doi.org/10.1109/..
 
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10

A Study on Memory Stack Process by Hybrid Copper Bonding (H..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Lee, Sanghoon ; Jee, Youngkun ; Park, Sangcheon... - p. 1085-1089 , 2022
Link: https://doi.org/10.1109/..
 
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11

Characterization of Die-to-Wafer Hybrid Bonding using Heter..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Kim, Min-Ki ; Park, Soojeoung ; Jang, Aeni... - p. 335-339 , 2022
Link: https://doi.org/10.1109/..
 
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12

A study on bonding pad structure and layout for Fine pitch ..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Kim, Juhyeon ; Seo, Sun-Kyoung ; Kim, Hyoeun... - p. 712-715 , 2022
Link: https://doi.org/10.1109/..
 
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13

Investigation on Package Warpage and Reliability of the lar..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Nam, Soohyun ; Kang, Jinhyun ; Lee, Ilbok... - p. 643-647 , 2022
Link: https://doi.org/10.1109/..
 
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14

Genetic Variants and Clinical Phenotypes in Korean Patients..:

Kim, Bo Gyeong ; Jung, Joo-hyun ; Kim, Mi-Jung...
Clinical and Experimental Otorhinolaryngology.  14 (2021)  4 - p. 399-406 , 2021
Link: https://doi.org/10.21053..
 
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15

Recent Developments in Nanoporous Graphene Membranes for Or..:

Nam, Yoon-Tae ; Kang, Jun-Hyeok ; Jang, Jae-Dong...
Membranes.  11 (2021)  10 - p. 793 , 2021
Link: https://doi.org/10.3390/..
 
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