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Kim, Gu-Sung
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1

LPWA Based Module for Forest Fire Detection:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Jo, Eunsol ; Jung, Cheong-Ha ; Kim, Gu-Sung - p. 167-168 , 2023
Link: https://doi.org/10.23919..
 
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2

Thermal analysis of TSV with design factors:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Seo, Seong-Won ; Kim, Gu-Sung - p. 1-3 , 2023
Link: https://doi.org/10.1109/..
 
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3

Parasitic effect analysis on TSV design factors:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Jung, Cheong-Ha ; Seo, Seong Won ; Kim, Gu-Sung - p. 249-251 , 2022
Link: https://doi.org/10.1109/..
 
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4

Signal Integrity Analysis of IPD Decoupling Capacitor Struc..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Park, Jung-Rae ; Cheong-Ha, Jung ; Kim, Gu-Sung - p. 261-264 , 2022
Link: https://doi.org/10.1109/..
 
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5

A study of electromigration effect according to interposer ..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Jung, Cheong-Ha ; Park, Jung-Rae ; Seo, Seong Won.. - p. 209-210 , 2022
Link: https://doi.org/10.23919..
 
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6

Stress behavior of solder joint in PET based chip for heter..:

, In: 2020 21st International Conference on Electronic Packaging Technology (ICEPT),
Jo, Eunsol ; Jung, Cheong-Ha ; Kim, Gu-Sung - p. 1-3 , 2020
Link: https://doi.org/10.1109/..
 
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7

Stress optimization study about heterogeneous multi-chip st..:

, In: 2019 20th International Conference on Electronic Packaging Technology(ICEPT),
Jung, Cheong-Ha ; Seo, Won ; Kim, Gu-sung - p. 1-4 , 2019
Link: https://doi.org/10.1109/..
 
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8

Thermal Stress Tracking in Multi-Die 3D Stacking Structure ..:

, In: 2019 International 3D Systems Integration Conference (3DIC),
Jung, Cheong-Ha ; Seo, Won ; Kim, Gu-sung - p. 1-2 , 2019
Link: https://doi.org/10.1109/..
 
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9

Wafer level package with thermal-stress-absorbing interface..:

Kim, Gu-Sung ; Kim, Sarah Eunkyung
Microelectronic Engineering.  89 (2012)  - p. 70-75 , 2012
Link: https://doi.org/10.1016/..
 
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10

A study of hot consolidation properties for recycled silico..:

Kong, Man-Sik ; Jung, Hang-Chul ; Hong, Hyun-Seon..
Current Applied Physics.  11 (2011)  1 - p. S54-S58 , 2011
Link: https://doi.org/10.1016/..
 
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11

Protection of flounder against hirame rhabdovirus (HIRRV) w..:

Seo, Ji Yeon ; Kim, Ki-Hong ; Kim, Sung-Gu...
Vaccine.  24 (2006)  7 - p. 1009-1015 , 2006
Link: https://doi.org/10.1016/..
 
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12

Laparoscopic repair of inguinal hernias: Risk factors for u..:

Kim, Sung Gu ; Son, Jungtack ; Lee, Sung Ryol.
Journal of Minimally Invasive Surgery.  24 (2021)  4 - p. 215-222 , 2021
Link: https://doi.org/10.7602/..
 
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13

Antioxidant activity and analysis of proanthocyanidins from..:

Park, Yong Soo ; Jeon, Min Hee ; Hwang, Hyun Jung...
Nutrition Research and Practice.  5 (2011)  4 - p. 281 , 2011
Link: https://doi.org/10.4162/..
 
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14

Comparison of methods for proanthocyanidin extraction from ..:

Kim, Nam-Young ; Jang, Min-Kyung ; Lee, Dong-Geun...
Nutrition Research and Practice.  4 (2010)  1 - p. 16 , 2010
Link: https://doi.org/10.4162/..
 
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15

Circardian Variation of Premature Ventricular Complex in Di..:

Choi, Tai Myoung ; Kim, Soon Kil ; Seo, Se Woong..
Korean Circulation Journal.  24 (1994)  2 - p. 228 , 1994
Link: https://doi.org/10.4070/..
 
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