Kim, Hongmin
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3

SkullID: Through-Skull Sound Conduction based Authenticatio..:

, In: Proceedings of the CHI Conference on Human Factors in Computing Systems,
Shin, Hyejin ; Huh, Jun Ho ; Kwon, Bum Jun... - p. 1-19 , 2024
 
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5

Hysteresis Compensation of Tendon-Sheath Mechanism Using No..:

Kim, Hongmin ; Kim, Dongchan ; Park, Su Hyeon.
IEEE Robotics and Automation Letters.  9 (2024)  6 - p. 5246-5253 , 2024
 
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6

Resonance Type Electrical Variable Capacitor with Reduced A..:

, In: 2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia),
Choi, Heewon ; Kim, Hongmin ; Hwang, Cheonghyeon.. - p. 3227-3233 , 2024
 
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7

Design of a Multimodal Fingertip Sensor for Dynamic Manipul..:

, In: 2023 IEEE International Conference on Robotics and Automation (ICRA),
 
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8

Towards Robust Autonomous Grasping with Reflexes Using High..:

, In: 2023 IEEE International Conference on Robotics and Automation (ICRA),
SaLoutos, Andrew ; Kim, Hongmin ; Stanger-Jones, Elijah.. - p. 10254-10260 , 2023
 
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9

Microstructural Evolution and Mechanical Properties Accordi..:

Kim, Hong-Min ; Park, Se-Yeong ; Lee, Dong-Geun
Korean Journal of Metals and Materials.  61 (2023)  8 - p. 545-552 , 2023
 
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10

Unveiling Truth Amidst the Pandemic: Multimodal Detection o..:

, In: Disinformation in Open Online Media; Lecture Notes in Computer Science,
Pathak, Royal ; Lakha, Bishal ; Raut, Rohan.. - p. 119-131 , 2023
 
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11

Improving Hand Gesture Recognition via Infrared Tomography ..:

, In: Lecture Notes in Computer Science; Human-Computer Interaction,
Kim, HongMin ; Oakley, Ian - p. 519-531 , 2023
 
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12

Electrical variable capacitor for RF plasma systems with a ..:

, In: 2023 11th International Conference on Power Electronics and ECCE Asia (ICPE 2023 - ECCE Asia),
 
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14

Modulation of Driver's Emotional States by Manipulating In-..:

Kim, Hodam ; Kim, Suhye ; Kim, Hongmin..
IEEE Transactions on Affective Computing.  13 (2022)  4 - p. 1783-1792 , 2022
 
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15

Recurrent Neural Network With Preisach Model for Configurat..:

Kim, Dongchan ; Kim, Hongmin ; Jin, Sangrok
IEEE Robotics and Automation Letters.  7 (2022)  2 - p. 2763-2770 , 2022
 
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