Kim, Hyun‐Woong
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1

No influence of regular rhythmic priming on grammaticality ..:

Kim, Hyun-Woong ; McLaren, Katie E. ; Lee, Yune Sang
Journal of Experimental Child Psychology.  237 (2024)  - p. 105760 , 2024
 
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3

Design and Analysis of LCC-S Wireless Power Transfer System..:

Woo, Seongho ; Shin, Yujun ; Lee, Changmin...
IEEE Transactions on Electromagnetic Compatibility.  66 (2024)  3 - p. 1015-1028 , 2024
 
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5

Methodology for Extracting Low-Frequency Input Impedance of..:

Rhee, Jaewon ; Kim, Hyunwoong ; Chu, Kwanguk.
IEEE Transactions on Electromagnetic Compatibility.  66 (2024)  2 - p. 584-598 , 2024
 
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6

A Method for Deembedding the Mounting Pad and Via-Hole Effe..:

Lee, Sanguk ; Kim, Hyunwoong ; Ahn, Jangyong...
IEEE Transactions on Instrumentation and Measurement.  73 (2024)  - p. 1-13 , 2024
 
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7

Design Methodology of Through-Silicon via for Crosstalk Opt..:

, In: 2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa),
Kim, Hyunwoong ; Lee, Seonghi ; Ahn, Seungyoung - p. 176-179 , 2024
 
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8

Signal Integrity Analysis and Design for Cascaded Wire Bond..:

, In: 2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa),
Ryu, Seunghun ; Kim, Hyunwoong ; Park, Gagyeong... - p. 221-224 , 2024
 
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10

Analysis of Methodology of Breakpoint Detection Method for ..:

, In: 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI),
Kim, Hyunwoong ; Lee, Sanguk ; Joung, Jong-Man.. - p. 191-195 , 2023
 
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11

Signal Integrity Analysis of Through-Silicon Via (TSV) With..:

Kim, Hyunwoong ; Lee, Seonghi ; Park, Jongcheol...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  13 (2023)  5 - p. 700-714 , 2023
 
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12

Closed loop obstruction of small bowel: CT signs predicting..:

Kim, Hye Ri ; Lee, Yedaun ; Kim, Jieun...
European Journal of Radiology.  161 (2023)  - p. 110716 , 2023
 
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13

3D-IC Power Distribution Network (PDN) Impedance Prediction..:

, In: 2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS),
 
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14

Design and Analysis of Double-side Characteristic Impedance..:

, In: 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI),
Lee, Seonghi ; Kim, Hyunwoong ; Park, Jiyoung... - p. 147-152 , 2023
 
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15

Signal Integrity Analysis of Wire Bonding Finger Capacitanc..:

, In: 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI),
Kim, Hyunwoong ; Park, Gagyeong ; Ryu, Seunghun... - p. 141-146 , 2023
 
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