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2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa) ,
7
Design Methodology of Through-Silicon via for Crosstalk Opt..:
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2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa) ,
8
Signal Integrity Analysis and Design for Cascaded Wire Bond..:
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2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI) ,
10
Analysis of Methodology of Breakpoint Detection Method for ..:
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2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) ,
13
3D-IC Power Distribution Network (PDN) Impedance Prediction..:
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2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI) ,
14
Design and Analysis of Double-side Characteristic Impedance..:
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2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI) ,
15