Kim, JungSeob
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1

Effective Thermal Solution via Wafer Level Packaging Materi..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Kim, Junghwa ; Na, Wool-Chul ; Kim, JungSeob... - p. 2013-2018 , 2020
 
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5

High-level expression and characterization of single chain ..:

Kim, Jung-Seob ; Min, Mi-Kyung ; Jo, Eui-Cheol
Biotechnology and Bioprocess Engineering.  6 (2001)  2 - p. 117-127 , 2001
 
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10

Exploring chemical space for lead identification by propaga..:

Yi, Jungseob ; Lee, Sangseon ; Lim, Sangsoo...
Computational and Structural Biotechnology Journal.  21 (2023)  - p. 4187-4195 , 2023
 
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11

Steering the structure and reactivity of Ag/Al2O3 by the ad..:

So, Jungseob ; Lee, Seung Jun ; Kim, Minkyu...
Applied Catalysis B: Environmental.  330 (2023)  - p. 122527 , 2023
 
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14

Doubts on the reliability of parallel corpus filtering:

Moon, Hyeonseok ; Park, Chanjun ; Koo, Seonmin...
Expert Systems with Applications.  233 (2023)  - p. 120962 , 2023
 
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15

Deciphering H2-induced low-temperature NOx adsorption on Ag..:

So, Jungseob ; Kwak, Jin-Su ; Lee, Dongseok...
Journal of Environmental Chemical Engineering.  11 (2023)  5 - p. 110745 , 2023
 
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