Kim, Min-Ki
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1

A study on D2W Hybrid Cu bonding Technology for HBM Multi-d..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lee, Hyeonmin ; Kim, Jihoon ; Kim, Min-Ki... - p. 76-80 , 2024
 
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D-MPQUIC: Optimizing Loss Detection in High RTT Variation N..:

, In: 2023 Fourteenth International Conference on Ubiquitous and Future Networks (ICUFN),
Kim, Min-Ki ; Cho, You-Ze - p. 254-258 , 2023
 
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5

Enhancing MPTCP Performance on High-Speed Trains with Predi..:

, In: 2023 14th International Conference on Information and Communication Technology Convergence (ICTC),
Kim, Min-Ki ; Cho, You-Ze - p. 1224-1226 , 2023
 
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6

Design and Development of the SNIPE Bus System:

Kim, Hae-Dong ; Choi, Won-Sub ; Kim, Min-Ki...
Journal of Space Technology and Applications.  2 (2022)  2 - p. 81-103 , 2022
 
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7

Characterization of Die-to-Wafer Hybrid Bonding using Heter..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Kim, Min-Ki ; Park, Soojeoung ; Jang, Aeni... - p. 335-339 , 2022
 
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8

Ground Test of Docking Phase for Nanosatellite:

Kim, Hae-Dong ; Choi, Won-Sub ; Kim, Min-Ki...
Journal of Space Technology and Applications.  1 (2021)  1 - p. 7-22 , 2021
 
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10

Finding Kinematics-Driven Latent Neural States From Neurona..:

Kim, Min-Ki ; Sohn, Jeong-Woo ; Kim, Sung-Phil
IEEE Transactions on Neural Systems and Rehabilitation Engineering.  29 (2021)  - p. 2027-2036 , 2021
 
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Launch Environment Test for Scale magNetospheric and Ionosp..:

Kim, Min-Ki ; Kim, Hae-Dong ; Choi, Won-Sub...
Journal of Space Technology and Applications.  1 (2021)  3 - p. 319-336 , 2021
 
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14

Development and evaluation of TPGS/PVA-based nanosuspension..:

Na, Young-Guk ; Pham, Thi Mai Anh ; Byeon, Jin-Ju...
International Journal of Pharmaceutics.  581 (2020)  - p. 119287 , 2020
 
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