Kim, Myeonghyeon
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1

Low Temperature Wafer Level Hybrid Bonding Enabled by Advan..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Inoue, Fumihiro ; Nagata, Atsushi ; Fuse, Junya... - p. 69-75 , 2024
 
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3

Estimation of deep-water formation intensity using multi-sa..:

Kim, Myeong-Hyeon ; Kim, Dae-Won ; Kim, Deoksu..
Deep Sea Research Part I: Oceanographic Research Papers.  194 (2023)  - p. 103969 , 2023
 
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8

Vortex detection in atomic Bose–Einstein condensates using ..:

Kim, Myeonghyeon ; Kwon, Junhwan ; Rabga, Tenzin.
Machine Learning: Science and Technology.  4 (2023)  4 - p. 045017 , 2023
 
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11

Passenger, airline, and policy responses to the COVID-19 cr..:

Kim, Myeonghyeon ; Sohn, Jeongwoong
Journal of Air Transport Management.  98 (2022)  - p. 102144 , 2022
 
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13

Vacuum Lamination of Polymer Gate Dielectric Layers for Fac..:

Kim, Min-Jae ; Hong, Jin-Hwan ; Kim, Myeong-Hyeon...
ACS Applied Electronic Materials.  4 (2022)  7 - p. 3640-3647 , 2022
 
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14

Modeling the flight departure delay using survival analysis..:

Kim, Myeonghyeon ; Bae, Jiheon
Journal of Air Transport Management.  91 (2021)  - p. 101996 , 2021
 
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15

Airport and route classification by modelling flight delay ..:

Kim, Myeonghyeon ; Park, Sunwook
Journal of Air Transport Management.  93 (2021)  - p. 102045 , 2021
 
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