Search for persons
X
?
Proceedings of the 2005 international conference on Augmented tele-existence ,
3
Depth-image based full 3D modeling using trilinear interpol..:
, In:
?
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) ,
4
Hybrid Solder with silver hierarchical structure and partic..:
, In:
?
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) ,
6
Study on the Embedded Flexible Hybrid Stack Package using P..:
, In:
?
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) ,
7
Evaluation of Crack Propagation at the Interconnection Inte..:
, In:
?
Proceedings of the 2005 international conference on Augmented tele-existence ,
12