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2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ,
6
3D Wafer-to-Wafer Bonding Thermal Resistance Comparison: Hy..:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
7
Novel Cu/SiCN surface topography control for 1 μm pitch hyb..:
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2019 International 3D Systems Integration Conference (3DIC) ,
8
Process Complexity and Cost Considerations of Multi-Layer D..:
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2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ,
14