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Kim, YehRi
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1

Thermo-Mechanical Reliability of Ag Porous Sheet Bonding St..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Kim, Dongjin ; Kim, YehRi ; Jo, Eunjin... - p. 149-150 , 2024
Link: https://doi.org/10.23919..
 
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2

Bonding Parameter-Dependent Microstructural and Mechanical ..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Kim, YehRi ; Jo, Eunjin ; Ju, Byeong Kwon... - p. 145-146 , 2024
Link: https://doi.org/10.23919..
 
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3

Solid-State Bonding with SAC305 Sheets for Direct Cooling:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Jo, Eunjin ; Kim, YehRi ; Park, Young-Bae. - p. 147-148 , 2024
Link: https://doi.org/10.23919..
 
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4

Temperature and thickness-dependent silver hillock generati..:

Kim, YehRi ; Kim, Seoah ; Zhang, Zheng...
Journal of Alloys and Compounds.  997 (2024)  - p. 174871 , 2024
Link: https://doi.org/10.1016/..
 
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5

Exceptional load-bearing capability of Al FPCB/Cu FPCB lap ..:

Kim, Seoah ; Kim, YehRi ; Jo, Eunjin...
Journal of Materials Research and Technology.  30 (2024)  - p. 6668-6685 , 2024
Link: https://doi.org/10.1016/..
 
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