E-LIB Suche - Ergebnisse für: Kim, Yeong K.

1

Corrigendum to "Wettable flank routable thin MicroLeadFrame..:

Kim, Byong Jin ; Jeon, HyeongIl ; Kim, GiJeong...
Microelectronics Reliability. 137 (2022) - p. 114781 , 2022

Link: https://doi.org/10.1016/..

2

Wettable flank routable thin MicroLeadFrame for automotive ..:

Kim, Byong Jin ; Jeon, HyeongIl ; Kim, GiJeong...
Microelectronics Reliability. 135 (2022) - p. 114602 , 2022

Link: https://doi.org/10.1016/..

3

Analyses on the large size PBGA packaging reliability under..:

Kim, Yeong K. ; Lee, Seok-min ; Hwang, Do-soon.
Microelectronics Reliability. 109 (2020) - p. 113654 , 2020

Link: https://doi.org/10.1016/..

4

PBGA Solder Stress Development Mechanism Analyses Under Ran..:

, In: 2020 Pan Pacific Microelectronics Symposium (Pan Pacific),

Kim, Yeong K. ; Jang, Seohyun ; Hwnag, Dosoon - p. 1-4 , 2020

Link: https://doi.org/10.23919..

5

High Frequency Effects on the PBGA Stress Developments at R..:

, In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC),

Kim, Yeong K. ; Lee, Seok M. ; Hwang, Dosoon. - p. 1-4 , 2019

Link: https://doi.org/10.23919..

6

Module packaging effects on MEMS airbag sensor performance ..:

Park, Dong Hyun ; Shin, Sojin ; Kim, Yeong K.
Microelectronics Reliability. 79 (2017) - p. 328-335 , 2017

Link: https://doi.org/10.1016/..

7

PBGA packaging reliability assessments under random vibrati..:

Kim, Yeong K. ; Hwang, Do Soon
Microelectronics Reliability. 55 (2015) 1 - p. 172-179 , 2015

Link: https://doi.org/10.1016/..

8

Improvement of butt-welding characteristics of double wall ..:

Lee, Bo-Young ; Kim, Yeong K. ; Hwnag, Woong-Gi..
Metals and Materials International. 18 (2012) 5 - p. 851-856 , 2012

Link: https://doi.org/10.1007/..

9

Butt-welding technology for double walled Polyethylene pipe:

Lee, Bo-Young ; Kim, Jae-Seong ; Lee, Sang-Yul.
Materials & Design. 35 (2012) - p. 626-632 , 2012

Link: https://doi.org/10.1016/..

10

Environmental considerations of plastic behaviors for autom..:

Kim, Yeong K. ; Kwon, Hyuk ; Choi, Won J...
Procedia Engineering. 10 (2011) - p. 1029-1034 , 2011

Link: https://doi.org/10.1016/..

11

Material property effects on solder failure analyses:

Kim, Yeong K. ; Gang, Jin Hyuk ; Lee, Bo-Young
Microelectronics Reliability. 51 (2011) 5 - p. 985-993 , 2011

Link: https://doi.org/10.1016/..

12

Warpage mechanism analyses of strip panel type PBGA chip pa..:

Kim, Yeong K. ; Park, In Soo ; Choi, Jooho
Microelectronics Reliability. 50 (2010) 3 - p. 398-406 , 2010

Link: https://doi.org/10.1016/..

13

Process-Induced Residual Stress Analysis by Resin Transfer ..:

Kim, Yeong K.
Journal of Composite Materials. 38 (2004) 11 - p. 959-972 , 2004

Link: https://doi.org/10.1177/..

14

Finite element simulation of package stress in transfer mol..:

Krondorfer, Rudolf ; Kim, Yeong K. ; Kim, Jaeok..
Microelectronics Reliability. 44 (2004) 12 - p. 1995-2002 , 2004

Link: https://doi.org/10.1016/..

15

Laser Ultrasonic Array System for Real-Time Cure Monitoring..:

Fomitchov, Pavel A. ; Kim, Yeong K. ; Kromine, Alexei K..
Journal of Composite Materials. 36 (2002) 15 - p. 1889-1901 , 2002

Link: https://doi.org/10.1177/..