Kim, Youjung
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4

Electrodeposition of Ru on Nanoscale Trench Patterns:

Kim, Youjung ; Lee, Jinhyun ; Seo, jinmyeong...
ECS Journal of Solid State Science and Technology.  , 2024
 
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5

Galvanic displacement deposition of Ag using citric acid fo..:

, In: 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM),
Kim, Youjung ; Yoon, Sanghwa ; Han, Haneul... - p. 1-3 , 2023
 
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6

Selective Copper Electrodeposition for Redistribution Layer..:

Lee, Jinhyun ; Kim, Youjung ; Han, Haneul...
ECS Journal of Solid State Science and Technology.  12 (2023)  11 - p. 114004 , 2023
 
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8

Ru electrodeposition and behaviors of additives for advance..:

, In: 2022 IEEE International Interconnect Technology Conference (IITC),
Kim, Youjung ; Han, Haneul ; Lee, Jinhyun. - p. 99-101 , 2022
 
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9

Cu to Cu direct bonding with optimized self-annealing behav..:

, In: 2022 IEEE International Interconnect Technology Conference (IITC),
Han, Hanuel ; Lee, Chaerin ; Park, Sangwoo.. - p. 111-113 , 2022
 
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12

Cu Electrochemical Polishing for RDL Process of FOWLP and E..:

Park, Kimoon ; Lee, Jinhyun ; Kim, Youjung..
ECS Journal of Solid State Science and Technology.  11 (2022)  3 - p. 034001 , 2022
 
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