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King Liu, Tsu-Jae
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1

Breakdown and Healing of Tungsten-Oxide Films on Microelect..:

Falicov, Ethan ; Marvin, Jessica ; Ye, Zhixin Alice...
Journal of Microelectromechanical Systems.  31 (2022)  2 - p. 265-274 , 2022
Link: https://doi.org/10.1109/..
 
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2

Examining the Self-Efficacy of Community College STEM Major..:

Amelink, Catherine T. ; Artis, Sharnnia ; King Liu, Tsu-Jae
Community College Journal of Research and Practice.  39 (2015)  12 - p. 1111-1124 , 2015
Link: https://doi.org/10.1080/..
 
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3

Electron mobility enhancement in (100) oxygen-inserted sili..:

Xu, Nuo ; Takeuchi, Hideki ; Hytha, Marek...
Applied Physics Letters.  107 (2015)  12 - p. , 2015
Link: https://doi.org/10.1063/..
 
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4

Mechanically modulated tunneling resistance in monolayer Mo..:

Fu, Deyi ; Zhou, Jian ; Tongay, Sefaattin...
Applied Physics Letters.  103 (2013)  18 - p. , 2013
Link: https://doi.org/10.1063/..
 
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5

Editorial:

King Liu, Tsu-Jae ; Koester, Steven J. ; Hartmann, Jean-Michel...
Solid-State Electronics.  83 (2013)  - p. 1 , 2013
Link: https://doi.org/10.1016/..
 
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6

Scaled Micro-Relay Structure with Low Strain Gradient for R..:

Chen, I-Ru ; Hutin, Louis ; Park, Chanro...
ECS Transactions.  45 (2012)  6 - p. 101-106 , 2012
Link: https://doi.org/10.1149/..
 
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7

Highly scaled (Lg∼56nm) gate-last Si tunnel field-effect tr..:

Loh, Wei-Yip ; Jeon, Kanghoon ; Kang, Chang Yong...
Solid-State Electronics.  65-66 (2011)  - p. 22-27 , 2011
Link: https://doi.org/10.1016/..
 
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8

Mechanical Computing Redux: Relays for Integrated Circuit A..:

Pott, Vincent ; Kam, Hei ; Nathanael, Rhesa...
Proceedings of the IEEE.  98 (2010)  12 - p. 2076-2094 , 2010
Link: https://doi.org/10.1109/..
 
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9

SRAM Read/Write Margin Enhancements Using FinFETs:

Carlson, Andrew ; Guo, Zheng ; Balasubramanian, Sriram...
IEEE Transactions on Very Large Scale Integration (VLSI) Systems.  18 (2010)  6 - p. 887-900 , 2010
Link: https://doi.org/10.1109/..
 
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10

Mechanical Properties of Polycrystalline Silicon formed by ..:

Lai, Joanna ; King Liu, Tsu-Jae
ECS Transactions.  16 (2008)  14 - p. 51-60 , 2008
Link: https://doi.org/10.1149/..
 
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11

ALD Refill of Nanometer-Scale Gaps with High-κ Dielectric f..:

Lee, Donovan ; Seidel, Thomas ; Dalton, Jeremie.
Electrochemical and Solid-State Letters.  10 (2007)  9 - p. H257 , 2007
Link: https://doi.org/10.1149/..
 
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12

Intrinsic Advantages of SOI Multiple-Gate MOSFET (MuGFET) f..:

Xiong, Weize W. ; Cleavelin, C. Rinn ; Hsu, Che-Hua...
ECS Transactions.  6 (2007)  4 - p. 59-69 , 2007
Link: https://doi.org/10.1149/..
 
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13

Selective Enhancement of SiO[sub 2] Etch Rate by Ar-Ion Imp..:

Sun, Xin ; Lu, Qiang ; Takeuchi, Hideki..
Electrochemical and Solid-State Letters.  10 (2007)  9 - p. D89 , 2007
Link: https://doi.org/10.1149/..
 
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14

Study of Poly-SiGe Structural Properties for Modularly Inte..:

Low, Carrie W. ; King Liu, Tsu-Jae ; Howe, Roger T.
ECS Transactions.  3 (2006)  7 - p. 1131-1142 , 2006
Link: https://doi.org/10.1149/..
 
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15

SiGe/Si Heterojunction Drain Transistor for Faster 3D NAND ..:

, In: 2024 IEEE International Memory Workshop (IMW),
Lee, Dasom ; Liu, Tsu-Jae King - p. 1-4 , 2024
Link: https://doi.org/10.1109/..
 
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