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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ,
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Reliability Prediction and Improvement of Board-Level Therm..:
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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ,
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Study on Enhancing Flip-Chip-Chip Scale Package (FCCSP) Rel..:
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2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
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A Study of JEDEC Board-Level Drop Test Performance Predicti..:
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2024 International Conference on Electronics Packaging (ICEP) ,
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