Ko, Yu-Chun
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3

Reliability Prediction and Improvement of Board-Level Therm..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Chen, Dao-Long ; Chen, Tang-Yuan ; Lai, Wei-Hong... - p. 995-998 , 2023
 
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4

Study on Enhancing Flip-Chip-Chip Scale Package (FCCSP) Rel..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
 
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5

A Study of JEDEC Board-Level Drop Test Performance Predicti..:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
 
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9

Alignment and Transfer of Silver Nanowire Arrays onto Uncon..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Chen, Yen-Shuo ; Liu, Shun-Yu ; Lin, Ching-Chang... - p. 255-256 , 2024
 
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12

Recent advances in the diagnosis and management of acute my..:

Hsieh, Yi-Keng ; Wang, Mei-Tzu ; Wang, Chien-Ying...
Journal of the Chinese Medical Association.  86 (2023)  11 - p. 950-959 , 2023
 
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13

The impact of end-stage kidney disease on mortality in pati..:

Chiang, Cheng-Hung ; Hung, Wan-Ting ; Tai, Ta-Hsin...
Journal of the Chinese Medical Association.  86 (2023)  8 - p. 740-747 , 2023
 
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