Kobayashi, Shoji
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1

Elucidating the mechanism of four corner voids in chip-on-w..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
 
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3

Method to evaluate the adhesion distribution on wafers:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Hiratsuka, Tatsumasa ; Hirano, Takaaki ; Kotoo, Kengo... - p. 1623-1627 , 2024
 
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7

Simulation of device structure impacts on bonding wave and ..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Hirano, Takaaki ; Yamada, Taichi ; Kobayashi, Shoji.. - p. 1314-1318 , 2023
 
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10

Modeling and simulation of coverage and film properties in ..:

Kuboi, Nobuyuki ; Matsugai, Hiroyasu ; Tatsumi, Tetsuya...
Japanese Journal of Applied Physics.  62 (2023)  SI - p. SI1006 , 2023
 
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13

Potential Degradation of 4‐Methyltetrahydropyran (4‐MeTHP) ..:

Kobayashi, Shoji ; Tamura, Tomoki
Asian Journal of Organic Chemistry.  10 (2021)  10 - p. 2675-2681 , 2021
 
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14

Total Synthesis, Structure Revision, and Neuroprotective Ef..:

Kobayashi, Shoji ; Tamura, Tomoki ; Koshishiba, Mizuho...
The Journal of Organic Chemistry.  86 (2021)  3 - p. 2602-2620 , 2021
 
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