Kobinata, Kyosuke
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1

Warpage Control Technology using 300 mm Waffle Wafer Evalua..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Doi, Wataru ; Funaki, Tatsuya ; Kobinata, Kyosuke... - p. 91-92 , 2024
 
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2

Precise Warpage Control Technology for 12-Inch Bumpless Via..:

, In: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Doi, Wataru ; Funaki, Tatsuya ; Kobinata, Kyosuke.. - p. 152-155 , 2023
 
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4

Functional Interposer Embedded with Multi-Terminal Si Capac..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
 
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5

Low-ESL (<1 pH @ 8.5 GHz) Multi-Terminal Si Capacitor Embed..:

, In: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
 
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8

First-principles study of Schottky barrier behavior at Fe3S..:

Kobinata, Kyosuke ; Nakayama, Takashi
Japanese Journal of Applied Physics.  53 (2014)  3 - p. 035701 , 2014
 
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