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2024 International Conference on Electronics Packaging (ICEP) ,
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Warpage Control Technology using 300 mm Waffle Wafer Evalua..:
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2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
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Precise Warpage Control Technology for 12-Inch Bumpless Via..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
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Functional Interposer Embedded with Multi-Terminal Si Capac..:
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2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) ,
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