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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
1
Novel Photo Imageable Film for RDL Application:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
2
A Novel FOPLP Structure with Chip First & RDL First Process..:
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2023 International Conference on Electronics Packaging (ICEP) ,
3
Novel Photo Imageable Film for Interlayer Insulation Applic..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
4
A Novel Chiplet Integration Architecture Employing Pillar-S..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
5
Novel Low Df Thermosetting Film and Photo Imageable Film:
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2022 International Conference on Electronics Packaging (ICEP) ,
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